TD

Thomas W. Dyer

IBM: 90 patents #680 of 70,183Top 1%
Infineon Technologies Ag: 13 patents #986 of 7,486Top 15%
Samsung: 7 patents #17,688 of 75,807Top 25%
CM Chartered Semiconductor Manufacturing: 4 patents #148 of 840Top 20%
Globalfoundries: 3 patents #1,029 of 4,424Top 25%
IN Infineon: 1 patents #4 of 37Top 15%
📍 Pleasant Valley, NY: #4 of 156 inventorsTop 3%
🗺 New York: #629 of 115,490 inventorsTop 1%
Overall (All Time): #16,540 of 4,157,543Top 1%
94
Patents All Time

Issued Patents All Time

Showing 76–94 of 94 patents

Patent #TitleCo-InventorsDate
7456450 CMOS devices with hybrid channel orientations and method for fabricating the same Xiangdong Chen, James J. Toomey, Haining Yang 2008-11-25
7452758 Process for making FinFET device with body contact and buried oxide junction isolation Haining Yang 2008-11-18
7442586 SOI substrate and SOI device, and method for forming the same Zhijiong Luo 2008-10-28
7442614 Silicon on insulator devices having body-tied-to-source and methods of making Jack A. Mandelman, Keith Kwong Hon Wong, Chih-Chao Yang, Haining Yang 2008-10-28
7436030 Strained MOSFETs on separated silicon layers Haining Yang, Wai-Kin Li 2008-10-14
7393746 Post-silicide spacer removal Sunfei Fang, Jiang Yan, Siddhartha Panda, Yong Meng Lee, Junjung Kim 2008-07-01
7390745 Pattern enhancement by crystallographic etching Kenneth T. Settlemyer, Jr., James J. Toomey, Haining Yang 2008-06-24
7122437 Deep trench capacitor with buried plate electrode and isolation collar Chun-Yung Sung, Ravikumar Ramachandran, Ramachandra Divakaruni, Carl Radens 2006-10-17
7101744 Method for forming self-aligned, dual silicon nitride liner for CMOS devices Haining Yang 2006-09-05
7023041 Trench capacitor vertical structure Giuseppe La Rosa, Oleg Gluschenkov, Jack A. Mandelman, Carl Radens, Alvin W. Strong 2006-04-04
6936511 Inverted buried strap structure and method for vertical transistor DRAM Ramachandra Divakaruni 2005-08-30
6897107 Method for forming TTO nitride liner for improved collar protection and TTO reliability Rama Divakaruni, Rajeev Malik, Jack A. Mandelman, Venkatachajam C. Jaiprakash 2005-05-24
6887761 Vertical semiconductor devices Hiroyuki Akatsu, Ravikumar Ramachandran, Kenneth T. Settlemyer, Jr. 2005-05-03
6809368 TTO nitride liner for improved collar protection and TTO reliability Rama Divakaruni, Rajeev Malik, Jack A. Mandelman, Venkatachalam C. Jaiprakash 2004-10-26
6794242 Extendible process for improved top oxide layer for DRAM array and the gate interconnects while providing self-aligned gate contacts Andreas Knorr, Laertis Economikos, Scott D. Halle, Rajeev Malik, Norbert Arnod 2004-09-21
6747306 Vertical gate conductor with buried contact layer for increased contact landing area 2004-06-08
6548344 Spacer formation process using oxide shield Jochen Beintner, Stephan Kudelka 2003-04-15
6518616 Vertical gate top engineering for improved GC and CB process windows Stephan Kudelka, Venkatachaiam C. Jaiprakash, Carl Radens 2003-02-11
6335248 Dual workfunction MOSFETs with borderless diffusion contacts for high-performance embedded DRAM technology Jack A. Mandelman 2002-01-01