Issued Patents All Time
Showing 51–75 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8492869 | 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer | Mukta G. Farooq, Robert Hannon, Steven J. Koester, Fei Liu, Sampath Purushothaman +2 more | 2013-07-23 |
| 8487425 | Optimized annular copper TSV | Paul S. Andry, Mukta G. Farooq, Robert Hannon, Emily R. Kinser, Cornelia K. Tsang +1 more | 2013-07-16 |
| 8455270 | 3D multiple die stacking | Mukta G. Farooq, Robert Hannon | 2013-06-04 |
| 8399336 | Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer | Mukta G. Farooq, Robert Hannon, Steven J. Koester, Fei Liu, Sampath Purushothaman +2 more | 2013-03-19 |
| 8372725 | Structures and methods of forming pre fabricated deep trench capacitors for SOI substrates | Robert Hannon, Gerd Pfeiffer, Ravi M. Todi, Kevin R. Winstel | 2013-02-12 |
| 8350269 | Semiconductor-on-insulator (SOI) structure and method of forming the SOI structure using a bulk semiconductor starting wafer | Edward J. Nowak | 2013-01-08 |
| 8298914 | 3D integrated circuit device fabrication using interface wafer as permanent carrier | Mukta G. Farooq, Robert Hannon, Steven J. Koester, Fei Liu, Sampath Purushothaman +2 more | 2012-10-30 |
| 8298908 | Structure and method for forming isolation and buried plate for trench capacitor | Abhishek Dube, Babar A. Khan, Oh-Jung Kwon, Junedong Lee, Paul C. Parries +4 more | 2012-10-30 |
| 8280382 | Cellular communication system and method of operation therefor | Gerard Terence Foster, Trevor T. Hanna, Luis Fernando Brisson Lopes, Howard John Thomas | 2012-10-02 |
| 8227304 | Semiconductor-on-insulator (SOI) structure and method of forming the SOI structure using a bulk semiconductor starting wafer | Edward J. Nowak | 2012-07-24 |
| 8189522 | Communicating system information in a wireless communication network | Christopher R. Cushing, Ajaykumar R. Idnani, David R. Maas, J. Chris Stanaway | 2012-05-29 |
| 8188528 | Structure and method to form EDRAM on SOI substrate | Chengwen Pei, Kangguo Cheng, Herbert L. Ho, Byeong Y. Kim, Geng Wang +1 more | 2012-05-29 |
| 8169321 | Radio frequency-enabled electromigration fuse | Chandrasekharan Kothandaraman, Gerard M. Salem | 2012-05-01 |
| 8158515 | Method of making 3D integrated circuits | Mukta G. Farooq, Steven J. Koester, Huilong Zhu | 2012-04-17 |
| 8129256 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Mukta G. Farooq, Robert Hannon, Steven J. Koester, Sampath Purushothaman, Roy R. Yu | 2012-03-06 |
| 7982285 | Antifuse structure having an integrated heating element | Byeongju Park, Chandrasekharan Kothandaraman | 2011-07-19 |
| 7939369 | 3D integration structure and method using bonded metal planes | Mukta G. Farooq | 2011-05-10 |
| 7880266 | Four-terminal antifuse structure having integrated heating elements for a programmable circuit | Byeongju Park, Chandrasekharan Kothandaraman | 2011-02-01 |
| 7750388 | Trench metal-insulator metal (MIM) capacitors | Herbert L. Ho, Vidhya Ramachandran | 2010-07-06 |
| 7732893 | Electrical fuse structure for higher post-programming resistance | Deok-kee Kim, Chandrasekharan Kothandaraman, Byeongju Park | 2010-06-08 |
| 7724707 | Network for a cellular communication system and a method of operation therefor | Gerard Terence Foster, Brian Moore | 2010-05-25 |
| 7696000 | Low defect Si:C layer with retrograde carbon profile | Yaocheng Liu, Jinghong Li | 2010-04-13 |
| 7682896 | Trench metal-insulator-metal (MIM) capacitors integrated with middle-of-line metal contacts, and method of fabricating same | Herbert L. Ho, Vidhya Ramachandran | 2010-03-23 |
| 7485944 | Programmable electronic fuse | Chandrasekharan Kothandaraman | 2009-02-03 |
| 7411818 | Programmable fuse/non-volatile memory structures using externally heated phase change material | Bruce G. Elmegreen, Deok-kee Kim, Lia Krusin-Elbaum, Dennis M. Newns, Byeongju Park | 2008-08-12 |