JO

John A. Ott

IBM: 73 patents #977 of 70,183Top 2%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
Samsung: 2 patents #37,631 of 75,807Top 50%
📍 Greenwood Lake, NY: #1 of 1 inventorsTop 100%
🗺 New York: #913 of 115,490 inventorsTop 1%
Overall (All Time): #24,281 of 4,157,543Top 1%
77
Patents All Time

Issued Patents All Time

Showing 51–75 of 77 patents

Patent #TitleCo-InventorsDate
8558326 Semiconductor devices having nanochannels confined by nanometer-spaced electrodes Stefan Harrer, Stanislav Polonsky, Mark B. Ketchen 2013-10-15
8530337 Method of large-area circuit layout recognition Stephen W. Bedell, Bahman Hekmatshoartabari, Ali Khakifirooz, Ghavam G. Shahidi, Davood Shahrjerdi 2013-09-10
8476617 Graphene-containing semiconductor structures and devices on a silicon carbide substrate having a defined miscut angle Christos D. Dimitrakopoulos, Alfred Grill, Timothy J. McArdle, Robert L. Wisnierff 2013-07-02
8236636 Hybrid orientation semiconductor structure with reduced boundary defects and method of forming same Haizhou Yin, Katherine L. Saenger, Chun-Yung Sung 2012-08-07
8153494 Nanowire MOSFET with doped epitaxial contacts for source and drain Jack O. Chu, Guy M. Cohen, Michael J. Rooks, Paul M. Solomon 2012-04-10
8138061 Quasi-hydrophobic Si-Si wafer bonding using hydrophilic Si surfaces and dissolution of interfacial bonding oxide Joel P. de Souza, Alexander Reznicek, Devendra K. Sadana, Katherine L. Saenger 2012-03-20
8053330 Quasi-hydrophobic Si-Si wafer bonding using hydrophilic Si surfaces and dissolution of interfacial bonding oxide Joel P. de Souza, Alexander Reznicek, Devendra K. Sadana, Katherine L. Saenger 2011-11-08
7999251 Nanowire MOSFET with doped epitaxial contacts for source and drain Jack O. Chu, Guy M. Cohen, Michael J. Rooks, Paul M. Solomon 2011-08-16
7863712 Hybrid orientation semiconductor structure with reduced boundary defects and method of forming same Haizhou Yin, Katherine L. Saenger, Chun-Yung Sung 2011-01-04
7785939 Planar substrate with selected semiconductor crystal orientations formed by localized amorphization and recrystallization of stacked template layers Joel P. de Souza, Alexander Reznicek, Katherine L. Saenger 2010-08-31
7705345 High performance strained silicon FinFETs device and method for forming same Stephen W. Bedell, Kevin K. Chan, Dureseti Chidambarrao, Silke H. Christianson, Jack O. Chu +4 more 2010-04-27
7652288 Epitaxial and polycrystalline growth of Si1-X-YGEXCY and Si1-YCY alloy layers on Si by UHV-CVD Jack O. Chu, Basanth Jaqannathan, Alfred Grill, Bernard S. Meyerson 2010-01-26
7550369 Method for fabricating low-defect-density changed orientation Si Joel P. de Souza, Keith E. Fogel, Devendra K. Sadana, Katherine L. Saenger 2009-06-23
7521376 Method of forming a semiconductor structure using a non-oxygen chalcogen passivation treatment Martin M. Frank, Steven J. Koester, Huiling Shang 2009-04-21
7405422 Epitaxial and polycrystalline growth of Si1-x-yGexCy and Si1-yCy alloy layers on Si by UHV-CVD Jack O. Chu, Basanth Jaqannathan, Alfred Grill, Bernard S. Meyerson 2008-07-29
7285473 Method for fabricating low-defect-density changed orientation Si Joel Pereira de Souza, Keith E. Fogel, Devendra K. Sadana, Katherine L. Saenger 2007-10-23
7183576 Epitaxial and polycrystalline growth of Si1-x-yGexCy and Si1-yCy alloy layers on Si by UHV-CVD Jack O. Chu, Basanth Jagannathan, Alfred Grill, Bernard S. Meyerson 2007-02-27
7084431 High speed composite p-channel Si/SiGe heterostructure for field effect devices Jack O. Chu, Richard Hammond, Khalid EzzEldin Ismail, Steven J. Koester, Patricia M. Mooney 2006-08-01
6908866 Epitaxial and polycrystalline growth of Si1-x-yGexCy and Si1-yCy alloy layers on Si by UHV-CVD Jack O. Chu, Basanth Jagannathan, Alfred Grill, Bernard S. Meyerson 2005-06-21
6858502 High speed composite p-channel Si/SiGe heterostructure for field effect devices Jack O. Chu, Richard Hammond, Khalid EzzEldin Ismail, Steven J. Koester, Patricia M. Mooney 2005-02-22
6805962 Method of creating high-quality relaxed SiGe-on-insulator for strained Si CMOS applications Stephen W. Bedell, Jack O. Chu, Keith E. Fogel, Steven J. Koester, Devendra K. Sadana 2004-10-19
6750119 Epitaxial and polycrystalline growth of Si1-x-yGexCy and Si1-yCy alloy layers on Si by UHV-CVD Jack O. Chu, Basanth Jagannathan, Alfred Grill, Bernard S. Meyerson 2004-06-15
6524935 Preparation of strained Si/SiGe on insulator by hydrogen induced layer transfer technique Donald F. Canaperi, Jack O. Chu, Christopher P. D'Emic, Lijuan Huang, Hon-Sum Philip Wong 2003-02-25
6475072 Method of wafer smoothing for bonding using chemo-mechanical polishing (CMP) Donald F. Canaperi, Jack O. Chu, Guy M. Cohen, Lijuan Huang, Michael F. Lofaro 2002-11-05
6350993 High speed composite p-channel Si/SiGe heterostructure for field effect devices Jack O. Chu, Richard Hammond, Khalid EzzEldin Ismail, Steven J. Koester, Patricia M. Mooney 2002-02-26