Issued Patents All Time
Showing 76–100 of 164 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7935604 | Method of making small geometry features | Jeffrey P. Gambino, Robert K. Leidy, Walter V. Lepuschenko, David Alan Meatyard, Stephen A. Mongeon +1 more | 2011-05-03 |
| 7923750 | Pixel sensor cell, methods and design structure including optically transparent gate | Rajendran Krishnasamy, John J. Ellis-Monaghan, Solomon Mulugeta, Charles F. Musante, Richard J. Rassel | 2011-04-12 |
| 7915571 | On demand circuit function execution employing optical sensing | Wagdi W. Abadeer, Jeffrey S. Brown, Kiran V. Chatty, Robert J. Gauthier, Jr., Michael J. Hauser +2 more | 2011-03-29 |
| 7886240 | Modifying layout of IC based on function of interconnect and related circuit and design structure | Natalie B. Feilchenfeld, Jeffrey P. Gambino, Howard S. Landis, Benjamin T. Voegeli, Steven H. Voldman +1 more | 2011-02-08 |
| 7829945 | Lateral diffusion field effect transistor with asymmetric gate dielectric profile | Natalie B. Feilchenfeld, Jeffrey P. Gambino, Benjamin T. Voegeli, Michael J. Zierak | 2010-11-09 |
| 7824961 | Stacked imager package | Jeffrey P. Gambino, Mark D. Jaffe, Robert K. Leidy, Stephen E. Luce, Richard J. Rassel +1 more | 2010-11-02 |
| 7800147 | CMOS image sensor with reduced dark current | Rajendran Krishnasamy | 2010-09-21 |
| 7790559 | Semiconductor transistors having high-K gate dielectric layers and metal gate electrodes | Michael P. Chudzik, Jeffrey P. Gambino, Hongwen Yan | 2010-09-07 |
| 7781781 | CMOS imager array with recessed dielectric | Jeffrey P. Gambino, Zhong-Xiang He, Mark D. Jaffe, Robert K. Leidy, Stephen E. Luce +2 more | 2010-08-24 |
| 7772028 | CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom | Jeffrey P. Gambino, Mark D. Jaffe, Robert K. Leidy, Richard J. Rassel, Anthony K. Stamper | 2010-08-10 |
| 7759755 | Anti-reflection structures for CMOS image sensors | John J. Ellis-Monaghan, Jeffrey P. Gambino, Charles F. Musante | 2010-07-20 |
| 7745863 | Flip FERAM cell and method to form same | Charles T. Black, Alfred Grill, Randy W. Mann, Deborah A. Neumayer, Wilbur D. Pricer +2 more | 2010-06-29 |
| 7732845 | Pixel sensor with reduced image lag | Jeffrey P. Gambino, Rajendran Krishnasamy, Solomon Mulugeta | 2010-06-08 |
| 7732841 | Pixel sensor cell for collecting electrons and holes | Andres Bryant, John J. Ellis-Monaghan, Mark D. Jaffe, Jeffrey B. Johnson, Alain Loiseau | 2010-06-08 |
| 7723178 | Shallow and deep trench isolation structures in semiconductor integrated circuits | Andres Bryant, Anthony K. Stamper, Mickey H. Yu | 2010-05-25 |
| 7719118 | Semiconductor chip scale package incorporating through-vias electrically connected to a substrate and other vias that are isolated from the substrate, and method of forming the package | Jeffrey P. Gambino, Mark D. Jaffe, Edmund J. Sprogis | 2010-05-18 |
| 7687340 | Protect diodes for hybrid-orientation substrate structures | Jeffrey P. Gambino, Alain Loiseau, Kirk D. Peterson | 2010-03-30 |
| 7675097 | Silicide strapping in imager transfer gate device | John J. Ellis-Monaghan, R. Michael Guidash, Mark D. Jaffe, Edward T. Nelson, Richard J. Rassel +1 more | 2010-03-09 |
| 7659564 | CMOS imager photodiode with enhanced capacitance | John J. Ellis-Monaghan, Mark D. Jaffe, Dale J. Pearson, Dennis L. Rogers | 2010-02-09 |
| 7659497 | On demand circuit function execution employing optical sensing | Wagdi W. Abadeer, Jeffrey S. Brown, Kiran V. Chatty, Robert J. Gauthier, Jr., Michael J. Hauser +2 more | 2010-02-09 |
| 7655966 | High efficiency CMOS image sensor pixel employing dynamic voltage supply | John J. Ellis-Monaghan, Mark D. Jaffe, Charles F. Musante, Richard J. Rassel | 2010-02-02 |
| 7655495 | Damascene copper wiring optical image sensor | Jeffrey P. Gambino, Mark D. Jaffe, Robert K. Leidy, Anthony K. Stamper | 2010-02-02 |
| 7633106 | Light shield for CMOS imager | Jeffrey P. Gambino, Mark D. Jaffe | 2009-12-15 |
| 7633042 | Pixel sensor cell having a pinning layer surrounding collection well regions for collecting electrons and holes | Andres Bryant, John J. Ellis-Monaghan, Mark D. Jaffe, Jeffrey B. Johnson, Alain Lolseau | 2009-12-15 |
| 7622364 | Bond pad for wafer and package for CMOS imager | Jeffrey P. Gambino, Mark D. Jaffe, Richard J. Rassel | 2009-11-24 |