Issued Patents All Time
Showing 26–50 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833268 | Resistive memory crossbar array with a multilayer hardmask | Takashi Ando, Asit Ray, Seyoung Kim | 2020-11-10 |
| 10797235 | Multivalent oxide cap for analog switching resistive memory | Takashi Ando, Marwan H. Khater, Seyoung Kim | 2020-10-06 |
| 10727121 | Thin film interconnects with large grains | Robert L. Bruce, Cyril Cabral, Jr., Gregory M. Fritz, Eric A. Joseph, Michael F. Lofaro +2 more | 2020-07-28 |
| 10727114 | Interconnect structure including airgaps and substractively etched metal lines | Robert L. Bruce, Alfred Grill, Eric A. Joseph, Teddie Peregrino Magbitang, Deborah A. Neumayer | 2020-07-28 |
| 10727407 | Resistive switching memory with replacement metal electrode | Takashi Ando, Seyoung Kim, Vijay Narayanan | 2020-07-28 |
| 10672980 | Resistive memory crossbar array with top electrode inner spacers | Takashi Ando, Iqbal Rashid Saraf, Shyng-Tsong Chen | 2020-06-02 |
| 10622553 | Cryogenic patterning of magnetic tunnel junctions | Anthony J. Annunziata, Chandrasekharan Kothandaraman, Nathan P. Marchack | 2020-04-14 |
| 10615250 | Tapered metal nitride structure | Martin M. Frank, Vijay Narayanan | 2020-04-07 |
| 10600656 | Directed self-assembly for copper patterning | Eric A. Joseph, Adam M. Pyzyna, HsinYu Tsai | 2020-03-24 |
| 10593870 | Sidewall image transfer on magnetic tunnel junction stack for magnetoresistive random-access memory patterning | Nathan P. Marchack, HsinYu Tsai, Eugene J. O'Sullivan, Karthik Yogendra | 2020-03-17 |
| 10593729 | Vertical array of resistive switching devices having restricted filament regions and tunable top electrode volume | Takashi Ando, Robert L. Bruce, John Rozen | 2020-03-17 |
| 10381463 | Patterned sidewall smoothing using a pre-smoothed inverted tone pattern | Kafai Lai, Hari V. Mallela, Reinaldo Vega, Rajasekhar Venigalla | 2019-08-13 |
| 10366323 | Crossbar resistive memory array with highly conductive copper/copper alloy electrodes and silver/silver alloys electrodes | Takashi Ando, Marwan H. Khater, Seyoung Kim | 2019-07-30 |
| 10361367 | Resistive memory crossbar array with top electrode inner spacers | Takashi Ando, Iqbal Rashid Saraf, Shyng-Tsong Chen | 2019-07-23 |
| 10304692 | Method of forming field effect transistor (FET) circuits, and forming integrated circuit (IC) chips with the FET circuits | John C. Arnold, Robert L. Bruce, Sebastian U. Engelmann, Nathan P. Marchack, Jeffrey C. Shearer +1 more | 2019-05-28 |
| 10236252 | Hybrid subtractive etch/metal fill process for fabricating interconnects | Robert L. Bruce, Gregory M. Fritz, Eric A. Joseph | 2019-03-19 |
| 10217661 | Articles including ultra low dielectric layers | Robert L. Bruce, Geraud Jean-Michel Dubois, Gregory M. Fritz, Teddie Peregrino Magbitang, Willi Volksen | 2019-02-26 |
| 10170697 | Cryogenic patterning of magnetic tunnel junctions | Anthony J. Annunziata, Chandrasekharan Kothandaraman, Nathan P. Marchack | 2019-01-01 |
| 10170361 | Thin film interconnects with large grains | Robert L. Bruce, Cyril Cabral, Jr., Gregory M. Fritz, Eric A. Joseph, Michael F. Lofaro +2 more | 2019-01-01 |
| 10147782 | Tapered metal nitride structure | Martin M. Frank, Vijay Narayanan | 2018-12-04 |
| 10141509 | Crossbar resistive memory array with highly conductive copper/copper alloy electrodes and silver/silver alloys electrodes | Takashi Ando, Marwan H. Khater, Seyoung Kim | 2018-11-27 |
| 10128185 | Hybrid subtractive etch/metal fill process for fabricating interconnects | Robert L. Bruce, Gregory M. Fritz, Eric A. Joseph | 2018-11-13 |
| 10096773 | Crossbar resistive memory array with highly conductive copper/copper alloy electrodes and silver/silver alloys electrodes | Takashi Ando, Marwan H. Khater, Seyoung Kim | 2018-10-09 |
| 10068991 | Patterned sidewall smoothing using a pre-smoothed inverted tone pattern | Kafai Lai, Hari V. Mallela, Reinaldo Vega, Rajasekhar Venigalla | 2018-09-04 |
| 10043668 | Selective dry etch for directed self assembly of block copolymers | Sebastian U. Engelmann, Ashish Jagtiani, HsinYu Tsai | 2018-08-07 |