Issued Patents All Time
Showing 76–98 of 98 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5788808 | Apparatus for forming cavity substrates using compressive pads | Robert W. Pasco, Charles H. Perry, Vincent P. Peterson | 1998-08-04 |
| 5785800 | Apparatus for forming cavity structures using thermally decomposable surface layer | Niranjan M. Patel, Kurt A. Smith | 1998-07-28 |
| 5783026 | Apparatus for stacking sheets by carriers | John U. Knickerbocker, Robert W. Pasco | 1998-07-21 |
| 5772837 | Apparatus for forming cavities without using an insert | Raschid J. Bezama, John U. Knickerbocker | 1998-06-30 |
| 5759320 | Method of forming cavity substrates using compressive pads | Robert W. Pasco, Charles H. Perry, Vincent P. Peterson | 1998-06-02 |
| 5746874 | Apparatus and method for forming cavity substrates using flexible preform insert | Robert W. Pasco | 1998-05-05 |
| 5707480 | Apparatus for forming multiple cavity products | Raschid J. Bezama, John U. Knickerbocker, Joseph G. Zhou | 1998-01-13 |
| 5707476 | Method for forming multiple cavity products | Raschid J. Bezama, John U. Knickerbocker, Joseph G. Zhou | 1998-01-13 |
| 5676788 | Method for forming cavity structures using thermally decomposable surface layer | Niranjan M. Patel, Kurt A. Smith | 1997-10-14 |
| 5665195 | Apparatus for forming cavities without using an insert | Raschid J. Bezama, John U. Knickerbocker | 1997-09-09 |
| 5655213 | Co-sintered surface metallization for pin-join, wire-bond and chip attach | Srinivasa S. N. Reddy | 1997-08-05 |
| 5639562 | Co-sintered surface metallization for pin-join, wire-bond and chip attach | Srinivasa S. N. Reddy | 1997-06-17 |
| 5613181 | Co-sintered surface metallization for pin-join, wire-bond and chip attach | Srinivasa S. N. Reddy | 1997-03-18 |
| 5541005 | Large ceramic article and method of manufacturing | Raschid J. Bezama, Jon A. Casey, Mario E. Ecker, Shaji Farooq, Irene S. Frantz +12 more | 1996-07-30 |
| 5538582 | Method for forming cavities without using an insert | Raschid J. Bezama, John U. Knickerbocker | 1996-07-23 |
| 5489465 | Edge seal technology for low dielectric/porous substrate processing | Takeshi Takamori, Katharine G. Frase, Thomas E. Lombardi, Robert A. Rita | 1996-02-06 |
| 5468445 | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same | Jon A. Casey, Renuka S. Divakaruni, Srinivasa S. N. Reddy, Manfred Sammet | 1995-11-21 |
| 5439636 | Large ceramic articles and method of manufacturing | Raschid J. Bezama, Jon A. Casey, Mario E. Ecker, Shaji Farooq, Irene S. Frantz +12 more | 1995-08-08 |
| 5336444 | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same | Jon A. Casey, Renuka S. Divakaruni, Srinivasa S. N. Reddy, Manfred Sammet | 1994-08-09 |
| 5139975 | Sintering arrangement for enhancing removal of carbon from ceramic substrate laminates | Lester W. Herron, Sarah H. Knickerbocker, Ananda H. Kumar, Srinivasa S. N. Reddy | 1992-08-18 |
| 5073180 | Method for forming sealed co-fired glass ceramic structures | Shaji Farooq, Srinivasa S. N. Reddy, Richard A. Shelleman, Nancy Cecelia Stoffel, Rao V. Vallabhaneni | 1991-12-17 |
| 5053361 | Setter tile for use in sintering of ceramic substrate laminates | Lester W. Herron, Sarah H. Knickerbocker, Srinivasa S. N. Reddy | 1991-10-01 |
| 4971738 | Enhanced removal of carbon from ceramic substrate laminates | Lester W. Herron, Sarah H. Knickerbocker, Ananda H. Kumar, Srinivasa S. N. Reddy | 1990-11-20 |