Issued Patents All Time
Showing 51–75 of 98 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6459039 | Method and apparatus to manufacture an electronic package with direct wiring pattern | Raschid J. Bezama, Robert W. Pasco | 2002-10-01 |
| 6423174 | Apparatus and insertless method for forming cavity substrates using coated membrane | Jon A. Casey, Robert W. Pasco, Vincent P. Peterson | 2002-07-23 |
| 6416849 | Method and structure to reduce low force pin pull failures in ceramic substrates | Raschid J. Bezama | 2002-07-09 |
| 6413339 | Low temperature sintering of ferrite materials | Jon A. Casey, Martin Klepeis, John U. Knickerbocker, Srinivasa S. N. Reddy, Robert A. Rita +1 more | 2002-07-02 |
| 6406778 | Multi-thickness, multi-layer green sheet lamination and method thereof | Krishna G. Sachdev, Abubaker S. Shagan | 2002-06-18 |
| 6395337 | Substrate with ceramic coating for camber modification and method for making | Raschid J. Bezama, Robert W. Pasco | 2002-05-28 |
| 6358439 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 2002-03-19 |
| 6332782 | Spatial transformation interposer for electronic packaging | Raschid J. Bezama, Robert W. Pasco | 2001-12-25 |
| 6319554 | Method and apparatus for surface metallization | Robert W. Pasco | 2001-11-20 |
| 6284079 | Method and structure to reduce low force pin pull failures in ceramic substrates | Raschid J. Bezama | 2001-09-04 |
| 6261927 | Method of forming defect-free ceramic structures using thermally depolymerizable surface layer | Richard F. Indyk, Vincent P. Peterson, Krishna G. Sachdev | 2001-07-17 |
| 6258192 | Multi-thickness, multi-layer green sheet processing | — | 2001-07-10 |
| 6254925 | Source metal embedded in an inert material and process thereof | John U. Knickerbocker, Robert A. Rita | 2001-07-03 |
| 6245171 | Multi-thickness, multi-layer green sheet lamination and method thereof | Krishna G. Sachdev, Abubaker S. Shagan | 2001-06-12 |
| 6245185 | Method of making a multilayer ceramic product with thin layers | Raschid J. Bezama, Dinesh Gupta | 2001-06-12 |
| 6194053 | Apparatus and method fabricating buried and flat metal features | Edward J. Pega | 2001-02-27 |
| 6190477 | Method and apparatus for preparing a release layer of ceramic particulates | Robert P. Kuder, II, Francis R. Krug, Jr., Edward J. Pega | 2001-02-20 |
| 6179951 | Method of protecting a non-planar feature using compressive pads and apparatus thereof | John U. Knickerbocker, Suresh D. Kadakia, Abubaker S. Shagan | 2001-01-30 |
| 6124041 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 2000-09-26 |
| 5976286 | Multi-density ceramic structure and process thereof | — | 1999-11-02 |
| 5925443 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 1999-07-20 |
| 5891281 | System and method for uniform product compressibility in a high throughput uniaxial lamination press | Michael J. Giordano, Edward J. Pega, Joseph G. Zhou | 1999-04-06 |
| 5882455 | Apparatus and method for forming isotropic multilayer ceramic substrates | Raschid J. Bezama, Robert W. Pasco | 1999-03-16 |
| 5876549 | Method and apparatus for stacking sheets supported by carriers | John U. Knickerbocker, Robert W. Pasco | 1999-03-02 |
| 5807455 | System and method for uniform product compressibility in a high throughput uniaxial lamination press | Michael J. Giordano, Edward J. Pega, Joseph G. Zhou | 1998-09-15 |