Issued Patents All Time
Showing 51–75 of 128 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7019522 | Apparatus for measuring the magnetic field produced by an insertion device | Joseph Duane Kulesza | 2006-03-28 |
| 6984286 | Adjusting fillet geometry to couple a heat spreader to a chip carrier | Barry A. Bonitz, Eric Duchesne, Michael A. Gaynes | 2006-01-10 |
| 6933619 | Electronic package and method of forming | David V. Caletka | 2005-08-23 |
| 6913948 | Partially captured oriented interconnections for BGA packages and a method of forming the interconnections | David V. Caletka | 2005-07-05 |
| 6905961 | Land grid array stiffener for use with flexible chip carriers | David V. Caletka, Krishna Darbha, William Infantolino | 2005-06-14 |
| 6883593 | Heat sink for convection cooling in horizontal applications | Randall J. Stutzman | 2005-04-26 |
| 6793123 | Packaging for multi-processor shared-memory system | Harm Peter Hofstee, Randall J. Stutzman, Jamil A. Wakil | 2004-09-21 |
| 6774474 | Partially captured oriented interconnections for BGA packages and a method of forming the interconnections | David V. Caletka | 2004-08-10 |
| 6691769 | Heat sink for convection cooling in horizontal applications | Randall J. Stutzman | 2004-02-17 |
| 6677522 | Package for electronic component | Charles F. Carey, Alfredo Migliore | 2004-01-13 |
| 6670223 | Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses | Michael A. Gaynes | 2003-12-30 |
| 6670322 | Method of targeting pharmaceuticals to motor neurons | Michael C. Goodnough, William H. Tepp, Carl J. Malizio | 2003-12-30 |
| 6667557 | Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connections | David J. Alcoe, Matthew Reiss, Charles G. Woychik | 2003-12-23 |
| 6665186 | Liquid metal thermal interface for an electronic module | Varaprasad V. Calmidi, Randall J. Stutzman | 2003-12-16 |
| 6623775 | Treating or preventing illness growth of Clostridium difficile | Gerhard J. Haas | 2003-09-23 |
| 6594481 | Apparatus and method for detecting potentially fradulent telecommunication | Mark J. Handzel | 2003-07-15 |
| 6570259 | Apparatus to reduce thermal fatigue stress on flip chip solder connections | David J. Alcoe, Matthew Reiss, Charles G. Woychik | 2003-05-27 |
| 6545126 | Chimeric toxins | Michael C. Goodnough, Carl J. Malizio, Alan Scott | 2003-04-08 |
| 6545869 | Adjusting fillet geometry to couple a heat spreader to a chip carrier | Barry A. Bonitz, Eric Duchesne, Michael A. Gaynes | 2003-04-08 |
| 6541847 | Packaging for multi-processor shared-memory system | Harm Peter Hofstee, Randall J. Stutzman, Jamil A. Wakil | 2003-04-01 |
| 6541857 | Method of forming BGA interconnections having mixed solder profiles | David V. Caletka | 2003-04-01 |
| 6534374 | Single damascene method for RF IC passive component integration in copper interconnect process | Chester Leung, Bo Yu, Yin Qian, Mark Hatzilambrou, My Doan | 2003-03-18 |
| 6528892 | Land grid array stiffener use with flexible chip carriers | David V. Caletka, Krishna Darbha, William Infantolino | 2003-03-04 |
| 6512295 | Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses | Michael A. Gaynes | 2003-01-28 |
| 6507116 | Electronic package and method of forming | David V. Caletka | 2003-01-14 |