Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8529556 | Detachable aneurysm neck bridge | Richard Murphy, Michael P. Wallace, Tri D. Tran, Kim Nguyen, Hanh Ho +2 more | 2013-09-10 |
| 8449532 | Detachable aneurysm neck bridge | Richard Murphy, Michael P. Wallace, Tri D. Tran, Kim Nguyen, Hanh Ho +2 more | 2013-05-28 |
| 8372062 | Detachable aneurysm neck bridge | Richard Murphy, Michael P. Wallace, Tri D. Tran, Kim Nguyen, Hanh Ho +2 more | 2013-02-12 |
| 8267923 | Detachable aneurysm neck bridge | Richard Murphy, Michael P. Wallace, Tri D. Tran, Kim Nguyen, Hanh Ho +2 more | 2012-09-18 |
| 7911014 | On chip antenna and method of manufacturing the same | — | 2011-03-22 |
| 7892248 | Occlusive cinching devices and methods of use | Tri D. Tran, Kim Nguyen, Hanh Ho, Richard Murphy, Michael P. Wallace +1 more | 2011-02-22 |
| 7713264 | Detachable aneurysm neck bridge | Richard Murphy, Michael P. Wallace, Tri D. Tran, Kim Nguyen, Hanh Ho +2 more | 2010-05-11 |
| 7410482 | Detachable aneurysm neck bridge | Richard Murphy, Michael P. Wallace, Tri D. Tran, Kim Nguyen, Hanh Ho +2 more | 2008-08-12 |
| 7349614 | VLSI-photonic heterogeneous integration by wafer bonding | — | 2008-03-25 |
| 7248773 | Method to trim and smooth high index contrast waveguide structures | Chang Kuo Chang, Chi Fo Tsang, Ramana Murthy Badam, Vladimir Bliznetsov | 2007-07-24 |
| 7229454 | Occlusive cinching devices and methods of use | Tri D. Tran, Kim Nguyen, Hanh Ho, Richard Murphy, Michael P. Wallace +1 more | 2007-06-12 |
| 7203387 | VLSI-photonic heterogeneous integration by wafer bonding | — | 2007-04-10 |
| 7164837 | Method of fabricating optical waveguide devices with smooth and flat dielectric interfaces | Joon Mo Kang, Desmond Lim | 2007-01-16 |
| 7162133 | Method to trim and smooth high index contrast waveguide structures | Chang Kuo Chang, Chi Fo Tsang, Ramana Murthy Badam, Vladimir Bliznetsov | 2007-01-09 |
| 6617241 | Method of thick film planarization | — | 2003-09-09 |
| 6534374 | Single damascene method for RF IC passive component integration in copper interconnect process | Eric A. Johnson, Chester Leung, Bo Yu, Yin Qian, Mark Hatzilambrou | 2003-03-18 |