EJ

Eric A. Johnson

IBM: 50 patents #1,732 of 70,183Top 3%
WARF: 27 patents #30 of 4,123Top 1%
AU Advanced Design Consulting Usa: 8 patents #1 of 8Top 15%
MP Milne Fruit Products: 6 patents #1 of 4Top 25%
IB Igene Biotechnology: 3 patents #2 of 14Top 15%
GN Gist-Brocades N.V.: 3 patents #36 of 275Top 15%
AU Authorize.Net: 3 patents #1 of 10Top 10%
TU T-Mobile Usa: 2 patents #533 of 1,165Top 50%
University of California: 2 patents #4,561 of 18,278Top 25%
GB Gist-Brocades B.V.: 2 patents #21 of 146Top 15%
VT Vlsi Technology: 2 patents #227 of 594Top 40%
SS S.S. Steiner: 2 patents #7 of 19Top 40%
MW Medical College Of Wisconsin: 2 patents #54 of 220Top 25%
Johnson & Johnson: 1 patents #4,762 of 7,810Top 65%
DN Dsm N.V.: 1 patents #267 of 669Top 40%
IM Institute Of Microelectronics: 1 patents #60 of 153Top 40%
MF Mcw Research Foundation: 1 patents #32 of 103Top 35%
MF Michael Foods: 1 patents #12 of 25Top 50%
SS Spa Societa Prodotti Antibiotici S.P.A.: 1 patents #6 of 16Top 40%
SR Scripps Research: 1 patents #709 of 1,293Top 55%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
📍 Flushing, MI: #1 of 114 inventorsTop 1%
🗺 Michigan: #143 of 86,293 inventorsTop 1%
Overall (All Time): #8,667 of 4,157,543Top 1%
128
Patents All Time

Issued Patents All Time

Showing 76–100 of 128 patents

Patent #TitleCo-InventorsDate
6495771 Compliant multi-layered circuit board for PBGA applications Michael A. Gaynes 2002-12-17
6490161 Peripheral land grid array package with improved thermal performance 2002-12-03
6486554 Molded body for PBGA and chip-scale packages 2002-11-26
6444209 Hybrid botulinal neurotoxins Michael C. Goodnough, Marite Bradshaw, William H. Tepp 2002-09-03
6410988 Thermally enhanced and mechanically balanced flip chip package and method of forming David V. Caletka, Jean Dery, Eric Duchesne, Michael A. Gaynes, Luis J. Matienzo +1 more 2002-06-25
6403882 Protective cover plate for flip chip assembly backside William T. Chen, Michael A. Gaynes, Tien Y. Wu 2002-06-11
6373703 Integral design features for heatsink attach for electronic packages Stephen J. Kosteva, Stephen W. MacQuarrie 2002-04-16
6341071 Stress relieved ball grid array package John S. Kresge 2002-01-22
6333551 Surface profiling in electronic packages for reducing thermally induced interfacial stresses David V. Caletka 2001-12-25
6319958 Method of sensitizing microbial cells to antimicrobial compound Byron F. Brehm-Stecher 2001-11-20
6288900 Warpage compensating heat spreader Seungbae Park 2001-09-11
6274474 Method of forming BGA interconnections having mixed solder profiles David V. Caletka 2001-08-14
6251461 Antimicrobial activity of hops extract against Clostridium botulinum, Clostridium difficile and Helicobacter pylori Gerhard J. Haas 2001-06-26
6191952 Compliant surface layer for flip-chip electronic packages and method for forming same Miquel A. Jimarez, Li Li, Jan Obrzut 2001-02-20
6104093 Thermally enhanced and mechanically balanced flip chip package and method of forming David V. Caletka, Jean Dery, Eric Duchesne, Michael A. Gaynes, Luis J. Matienzo +1 more 2000-08-15
6040631 Method of improved cavity BGA circuit package Eric P. Dibble, Raymond Phillips 2000-03-21
5972642 Astaxanthin-producing yeast cells, methods for their preparation and their use Bent Flen.o slashed., Ib Christensen, Robert Larsen, Steffen Radich Johansen 1999-10-26
5969945 Electronic package assembly Lawrence R. Cutting, Michael A. Gaynes, Cynthia S. Milkovich, Jeffrey S. Perkins, Mark V. Pierson +2 more 1999-10-19
5969947 Integral design features for heatsink attach for electronic packages Stephen J. Kosteva, Stephen W. MacQuarrie 1999-10-19
5955368 Expression system for clostridium species Marite Bradshaw, Julian Ian Rood, Dena Lyras 1999-09-21
5939070 Hybrid botulinal neurotoxins Michael C. Goodnough, Marite Bradshaw 1999-08-17
5914857 Air flow devices for electronic boards Sanjeev Sathe 1999-06-22
5907800 Apparatus for use in inhibiting telecommunication subscriber termination Howard Kaushansky, Sunil Prakash, Martin Brunecky, Eileen M. McGrath-Hadwen 1999-05-25
5888849 Method for fabricating an electronic package 1999-03-30
5883430 Thermally enhanced flip chip package 1999-03-16