Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6191952 | Compliant surface layer for flip-chip electronic packages and method for forming same | Eric A. Johnson, Li Li, Jan Obrzut | 2001-02-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6191952 | Compliant surface layer for flip-chip electronic packages and method for forming same | Eric A. Johnson, Li Li, Jan Obrzut | 2001-02-20 |