Issued Patents All Time
Showing 51–71 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8771533 | Edge protection seal for bonded substrates | Mukta G. Farooq, Richard S. Wise, Hakeem B. S. Akinmade-Yusuff | 2014-07-08 |
| 8765597 | Fluorine depleted adhesion layer for metal interconnect structure | Mukta G. Farooq | 2014-07-01 |
| 8749059 | Semiconductor device having a copper plug | Mukta G. Farooq, Ian D. Melville, Krystyna W. Semkow | 2014-06-10 |
| 8741769 | Semiconductor device having a copper plug | Mukta G. Farooq, Ian D. Melville, Krystyna W. Semkow | 2014-06-03 |
| 8692246 | Leakage measurement structure having through silicon vias | Bhavana Bhoovaraghan, Mukta G. Farooq, Sudesh Saroop | 2014-04-08 |
| 8679611 | Edge protection seal for bonded substrates | Mukta G. Farooq, Richard S. Wise, Hakeem B. S. Akinmade-Yusuff | 2014-03-25 |
| 8658535 | Optimized annular copper TSV | Paul S. Andry, Mukta G. Rarooq, Robert Hannon, Subramanian S. Iyer, Comelia K. Tsang +1 more | 2014-02-25 |
| 8610283 | Semiconductor device having a copper plug | Mukta G. Farooq, Ian D. Melville, Krystyna W. Semkow | 2013-12-17 |
| 8586431 | Three dimensional integration and methods of through silicon via creation | Mukta G. Farooq, Richard S. Wise, Hakeem Yusuff | 2013-11-19 |
| 8569154 | Three dimensional integration and methods of through silicon via creation | Mukta G. Farooq, Richard S. Wise, Hakeem Yusuff | 2013-10-29 |
| 8563423 | Fluorine depleted adhesion layer for metal interconnect structure | Mukta G. Farooq | 2013-10-22 |
| 8546961 | Alignment marks to enable 3D integration | Mukta G. Farooq, Troy L. Graves-Abe, Robert Hannon, William Francis Landers, Kevin S. Petrarca +2 more | 2013-10-01 |
| 8492252 | Three dimensional integration and methods of through silicon via creation | Mukta G. Farooq, Richard S. Wise, Hakeem Yusuff | 2013-07-23 |
| 8486814 | Wafer backside defectivity clean-up utilizing selective removal of substrate material | Jennifer C. Clark, Ian D. Melville, Candace A. Sullivan | 2013-07-16 |
| 8487425 | Optimized annular copper TSV | Paul S. Andry, Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Cornelia K. Tsang +1 more | 2013-07-16 |
| 8415238 | Three dimensional integration and methods of through silicon via creation | Mukta G. Farooq, Richard S. Wise, Hakeem Yusuff | 2013-04-09 |
| 8399180 | Three dimensional integration with through silicon vias having multiple diameters | Mukta G. Farooq, Ramona Kei, Anthony D. Lisi, Richard S. Wise, Hakeem Yusuff | 2013-03-19 |
| 8287980 | Edge protection seal for bonded substrates | Mukta G. Farooq, Richard S. Wise, Hakeem B. S. Akinmade-Yusuff | 2012-10-16 |
| 8039964 | Fluorine depleted adhesion layer for metal interconnect structure | Mukta G. Farooq | 2011-10-18 |
| 8022543 | Underbump metallurgy for enhanced electromigration resistance | Mukta G. Farooq, Robert Hannon, Ian D. Melville | 2011-09-20 |
| 7910484 | Method for preventing backside defects in dielectric layers formed on semiconductor substrates | Chester T. Dziobkowski, Thomas Houghton, Darryl D. Restaino, Yun-Yu Wang | 2011-03-22 |