Issued Patents All Time
Showing 26–50 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10694951 | Probe structure for physiological measurements using surface enhanced Raman spectroscopy | John U. Knickerbocker, Roy R. Yu | 2020-06-30 |
| 10669153 | Neuro-chemical sensor with selectively permeable membrane on nano-electrode | Steven J. Holmes, Qinghuang Lin, Nathan P. Marchack, Roy R. Yu | 2020-06-02 |
| 10618806 | Neuro-chemical sensor with selectively permeable membrane on nano-electrode | Steven J. Holmes, Qinghuang Lin, Nathan P. Marchack, Roy R. Yu | 2020-04-14 |
| 10610621 | Antibacterial medical implant surface | Stacey Gifford, Huan Hu, Roy R. Yu, Sufi Zafar | 2020-04-07 |
| 10583282 | Neuro-stem cell stimulation and growth enhancement with implantable nanodevice | Steven J. Holmes, Qinghuang Lin, Nathan P. Marchack, Roy R. Yu | 2020-03-10 |
| 10583471 | Neuro-chemical sensor with inhibition of fouling on nano-electrode | Steven J. Holmes, Qinghuang Lin, Nathan P. Marchack, Roy R. Yu | 2020-03-10 |
| 10548530 | Biosensor calibration structure containing different sensing surface area | — | 2020-02-04 |
| 10376193 | Embedded sacrificial layer to enhance biosensor stability and lifetime for nanopatterned electrodes | — | 2019-08-13 |
| 10216008 | Saccade and vergence tracking for distance auto focus adjustment | John U. Knickerbocker, Roy R. Yu | 2019-02-26 |
| 10213144 | Nanopatterned biosensor electrode for enhanced sensor signal and sensitivity | Themistoclis Kyriakides, Jagannath Padmanabhan | 2019-02-26 |
| 10168550 | Saccade and vergence tracking for distance auto focus adjustment | John U. Knickerbocker, Roy R. Yu | 2019-01-01 |
| 10161898 | Nanopatterned biosensor electrode for enhanced sensor signal and sensitivity | — | 2018-12-25 |
| 10067061 | Patch clamp technique with complementary raman spectroscopy | Roy R. Yu | 2018-09-04 |
| 9995686 | Patch clamp technique with complementary Raman spectroscopy | Roy R. Yu | 2018-06-12 |
| 9738517 | Mold for forming complex 3D MEMS components | Jan Schroers, Golden Kumar | 2017-08-22 |
| 9406561 | Three dimensional integrated circuit integration using dielectric bonding first and through via formation last | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer | 2016-08-02 |
| 9263386 | Forming BEOL line fuse structure | Mukta G. Farooq | 2016-02-16 |
| 9257361 | In-situ thermoelectric cooling | Mukta G. Farooq, JoAnn M. Rolick-DiGiacomio, Charu Tejwani | 2016-02-09 |
| 9249015 | Mold for forming complex 3D MEMS components | Jan Schroers, Golden Kumar | 2016-02-02 |
| 9059175 | Forming BEOL line fuse structure | Mukta G. Farooq | 2015-06-16 |
| 8933562 | In-situ thermoelectric cooling | Mukta G. Farooq, JoAnn M. Rolick-DiGiacomio, Charu Tejwani | 2015-01-13 |
| 8922019 | Semiconductor device having a copper plug | Mukta G. Farooq, Ian D. Melville, Krystyna W. Semkow | 2014-12-30 |
| 8871636 | Fluorine depleted adhesion layer for metal interconnect structure | Mukta G. Farooq | 2014-10-28 |
| 8835194 | Leakage measurement of through silicon vias | Bhavana Bhoovaraghan, Mukta G. Farooq, Sudesh Saroop | 2014-09-16 |
| 8835289 | Wafer backside defectivity clean-up utilizing selective removal of substrate material | Jennifer C. Clark, Ian D. Melville, Candace A. Sullivan | 2014-09-16 |