Issued Patents All Time
Showing 51–75 of 123 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9384879 | Magnetic multilayer structure | Philipp Herget, Eugene J. O'Sullivan, Lubomyr T. Romankiw, Naigang Wang | 2016-07-05 |
| 9324495 | Planar inductors with closed magnetic loops | Robert E. Fontana, Jr., William J. Gallagher, Philipp Herget, Eugene J. O'Sullivan, Lubomyr T. Romankiw +1 more | 2016-04-26 |
| 9312761 | Three-D power converter in three distinct strata | Paul S. Andry, Leland Chang, Evan G. Colgan, John U. Knickerbocker, Robert L. Wisnieff | 2016-04-12 |
| 9257137 | Magnetic writer having multiple gaps with more uniform magnetic fields across the gaps | Robert G. Biskeborn, Philipp Herget | 2016-02-09 |
| 9245824 | Through-vias for wiring layers of semiconductor devices | Christopher V. Jahnes, Xiao Hu Liu | 2016-01-26 |
| 9245850 | Through silicon via wafer, contacts and design structures | Jeffrey P. Gambino, Cameron E. Luce, Daniel S. Vanslette | 2016-01-26 |
| 9236325 | Through-vias for wiring layers of semicondutor devices | Christopher V. Jahnes, Xiao Hu Liu | 2016-01-12 |
| 9159778 | Silicon process compatible trench magnetic device | Naigang Wang | 2015-10-13 |
| 9082781 | Semiconductor article having a zig-zag guard ring and method of forming the same | Ronald G. Filippi, Erdem Kaltalioglu, Xiao Hu Liu, Thomas M. Shaw, Ping-Chuan Wang +1 more | 2015-07-14 |
| 9064628 | Inductor with stacked conductors | Robert E. Fontana, Jr., Philipp Herget, Eugene J. O'Sullivan, Lubomyr T. Romankiw, Naigang Wang | 2015-06-23 |
| 9041210 | Through silicon via wafer and methods of manufacturing | Jeffrey P. Gambino, Jessica A. Levy, Cameron E. Luce, Daniel S. Vanslette | 2015-05-26 |
| 8801352 | Pick and place tape release for thin semiconductor dies | — | 2014-08-12 |
| 8796138 | Through substrate vias | John M. Cotte, Christopher V. Jahnes | 2014-08-05 |
| 8791016 | Through silicon via wafer, contacts and design structures | Jeffrey P. Gambino, Cameron E. Luce, Daniel S. Vanslette | 2014-07-29 |
| 8759961 | Underfill material dispensing for stacked semiconductor chips | Jae-Woong Nah, Katsuyuki Sakuma | 2014-06-24 |
| 8759963 | Underfill material dispensing for stacked semiconductor chips | Jae-Woong Nah, Katsuyuki Sakuma | 2014-06-24 |
| 8754500 | Plated lamination structures for integrated magnetic devices | — | 2014-06-17 |
| 8736277 | Integrated transformers | Dennis G. Manzer | 2014-05-27 |
| 8717136 | Inductor with laminated yoke | Robert E. Fontana, Jr., William J. Gallagher, Philipp Herget, Eugene J. O'Sullivan, Lubomyr T. Romankiw +1 more | 2014-05-06 |
| 8686522 | Semiconductor trench inductors and transformers | — | 2014-04-01 |
| 8670210 | Magnetic writer having multiple gaps with more uniform magnetic fields across the gaps | Robert G. Biskeborn, Philipp Herget | 2014-03-11 |
| 8492901 | Metal oxide semiconductor (MOS)-compatible high-aspect ratio through-wafer vias and low-stress configuration thereof | — | 2013-07-23 |
| 8487447 | Semiconductor structure having offset passivation to reduce electromigration | Mario J. Interrante, Gary LaFontant, Michael J. Shapiro, Thomas A. Wassick | 2013-07-16 |
| 8427780 | Planar magnetic writer having offset portions | Robert G. Biskeborn, Lubomyr T. Romankiw, Steven E. Steen | 2013-04-23 |
| 8385018 | Magnetic writer having multiple gaps with more uniform magnetic fields across the gaps | Robert G. Biskeborn, Philipp Herget | 2013-02-26 |