Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735412 | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Atsushi Sano, Kenji Kameda | 2023-08-22 |
| 10720325 | Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium | Takafumi Nitta, Satoshi Shimamoto, Hiroki Yamashita | 2020-07-21 |
| 10604842 | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Katsuyoshi Harada, Satoshi Shimamoto, Shin SONE | 2020-03-31 |
| 10586698 | Method of manufacturing semiconductor device, substrate processing apparatus and recording medium | Yoshitomo HASHIMOTO, Masaya NAGATO | 2020-03-10 |
| 10290492 | Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium | Katsuyoshi Harada, Satoshi Shimamoto, Hiroki HATTA | 2019-05-14 |
| 10026607 | Substrate processing apparatus for forming film including at least two different elements | Hajime Karasawa, Yoshiro Hirose | 2018-07-17 |
| 9487861 | Substrate processing apparatus capable of forming films including at least two different elements | Hajime Karasawa, Yoshiro Hirose | 2016-11-08 |
| 9478417 | Method of manufacturing semiconductor device for forming film including at least two different elements | Hajime Karasawa, Yoshiro Hirose | 2016-10-25 |
| 9455137 | Method of manufacturing semiconductor device | Yoshiro Hirose, Tsukasa Kamakura, Yoshinobu Nakamura, Ryota Sasajima | 2016-09-27 |
| 9443720 | Method of manufacturing semiconductor device for forming film including at least two different elements | Hajime Karasawa, Yoshiro Hirose | 2016-09-13 |
| 9443719 | Method of manufacturing semiconductor device for forming film including at least two different elements | Hajime Karasawa, Yoshiro Hirose | 2016-09-13 |
| 9384971 | Method of manufacturing semiconductor device by forming a film on a substrate | Hajime Karasawa, Yoshiro Hirose | 2016-07-05 |
| 9384966 | Method of manufacturing a semiconductor device by forming a film on a substrate | Hajime Karasawa, Yoshiro Hirose | 2016-07-05 |
| 9384967 | Method of manufacturing a semiconductor device by forming a film on a substrate | Hajime Karasawa, Yoshiro Hirose | 2016-07-05 |
| 9384968 | Method of manufacturing a semiconductor device by forming a film on a substrate | Hajime Karasawa, Yoshiro Hirose | 2016-07-05 |
| 9384969 | Method of manufacturing semiconductor device by forming a film on a substrate | Hajime Karasawa, Yoshiro Hirose | 2016-07-05 |
| 9384970 | Method of manufacturing semiconductor device by forming a film on a substrate | Hajime Karasawa, Yoshiro Hirose | 2016-07-05 |
| 9384972 | Method of manufacturing semiconductor device by forming a film on a substrate | Hajime Karasawa, Yoshiro Hirose | 2016-07-05 |
| 9385013 | Method and apparatus of manufacturing a semiconductor device by forming a film on a substrate | Hajime Karasawa, Yoshiro Hirose | 2016-07-05 |
| 9378943 | Method of manufacturing semiconductor device, method of processing substrate substrate processing apparatus and non-transitory computer-readable recording medium | Yoshiro Hirose, Tsukasa Kamakura, Yoshinobu Nakamura, Ryota Sasajima | 2016-06-28 |
| 9334567 | Method for manufacturing semiconductor device, method for processing substrate and substrate processing apparatus | Yoshiro Hirose, Kenji Kanayama, Norikazu Mizuno, Yosuke Ota | 2016-05-10 |
| 9330904 | Method of manufacturing semiconductor device and substrate processing apparatus | Hajime Karasawa, Yoshiro Hirose | 2016-05-03 |
| 9318316 | Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus for forming thin film containing at least two different elements | Hajime Karasawa, Yoshiro Hirose | 2016-04-19 |
| 9312123 | Method of manufacturing semiconductor device and substrate processing apparatus | Hajime Karasawa, Yoshiro Hirose | 2016-04-12 |
| 9269566 | Substrate processing apparatus | Naonori Akae, Yoshiro Hirose, Yosuke Ota | 2016-02-23 |