HK

Hajime Karasawa

HE Hitachi Kokusai Electric: 20 patents #21 of 843Top 3%
KE Kokusai Electric: 3 patents #177 of 583Top 35%
HI Hitachi: 1 patents #17,742 of 28,497Top 65%
TI Texas Instruments: 1 patents #7,357 of 12,488Top 60%
📍 Toyama, JP: #125 of 1,699 inventorsTop 8%
Overall (All Time): #166,936 of 4,157,543Top 5%
24
Patents All Time

Issued Patents All Time

Showing 1–24 of 24 patents

Patent #TitleCo-InventorsDate
12217959 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium Kimihiko NAKATANI, Tsukasa Kamakura, Kazuhiro Harada 2025-02-04
10720324 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium Kimihiko NAKATANI, Hiroshi Ashihara, Kazuhiro Harada 2020-07-21
10199219 Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium Satoshi Shimamoto, Yoshiro Hirose, Ryota Horiike, Naoharu Nakaiso, Yoshitomo HASHIMOTO 2019-02-05
10032630 Method of manufacturing semiconductor device Katsuhiko Yamamoto, Kazuyuki Toyoda 2018-07-24
10026607 Substrate processing apparatus for forming film including at least two different elements Yushin Takasawa, Yoshiro Hirose 2018-07-17
9487861 Substrate processing apparatus capable of forming films including at least two different elements Yushin Takasawa, Yoshiro Hirose 2016-11-08
9478417 Method of manufacturing semiconductor device for forming film including at least two different elements Yushin Takasawa, Yoshiro Hirose 2016-10-25
9443719 Method of manufacturing semiconductor device for forming film including at least two different elements Yushin Takasawa, Yoshiro Hirose 2016-09-13
9443720 Method of manufacturing semiconductor device for forming film including at least two different elements Yushin Takasawa, Yoshiro Hirose 2016-09-13
9384968 Method of manufacturing a semiconductor device by forming a film on a substrate Yushin Takasawa, Yoshiro Hirose 2016-07-05
9384969 Method of manufacturing semiconductor device by forming a film on a substrate Yushin Takasawa, Yoshiro Hirose 2016-07-05
9384970 Method of manufacturing semiconductor device by forming a film on a substrate Yushin Takasawa, Yoshiro Hirose 2016-07-05
9384971 Method of manufacturing semiconductor device by forming a film on a substrate Yushin Takasawa, Yoshiro Hirose 2016-07-05
9384972 Method of manufacturing semiconductor device by forming a film on a substrate Yushin Takasawa, Yoshiro Hirose 2016-07-05
9385013 Method and apparatus of manufacturing a semiconductor device by forming a film on a substrate Yushin Takasawa, Yoshiro Hirose 2016-07-05
9384966 Method of manufacturing a semiconductor device by forming a film on a substrate Yushin Takasawa, Yoshiro Hirose 2016-07-05
9384967 Method of manufacturing a semiconductor device by forming a film on a substrate Yushin Takasawa, Yoshiro Hirose 2016-07-05
9330904 Method of manufacturing semiconductor device and substrate processing apparatus Yushin Takasawa, Yoshiro Hirose 2016-05-03
9318316 Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus for forming thin film containing at least two different elements Yushin Takasawa, Yoshiro Hirose 2016-04-19
9312123 Method of manufacturing semiconductor device and substrate processing apparatus Yushin Takasawa, Yoshiro Hirose 2016-04-12
8409988 Method of manufacturing semiconductor device and substrate processing apparatus Yushin Takasawa, Yoshiro Hirose 2013-04-02
6943089 Semiconductor device manufacturing method and semiconductor manufacturing apparatus Yushin Takasawa 2005-09-13
6821871 Method for manufacturing semiconductor device, substrate treatment method, and semiconductor manufacturing apparatus Hisashi Nomura, Yushin Takasawa, Yoshinori Imai, Tadanori Yoshida, Kenichi Yamaguchi 2004-11-23
5473774 Method for conflict detection in parallel processing system Jimmie D. Childers 1995-12-05