RA

Roderick A. Augur

GU Globalfoundries U.S.: 23 patents #24 of 665Top 4%
Globalfoundries: 15 patents #235 of 4,424Top 6%
AM AMD: 3 patents #3,141 of 9,279Top 35%
KT Khalifa University Of Science And Technology: 1 patents #98 of 290Top 35%
📍 Saratoga Springs, NY: #11 of 363 inventorsTop 4%
🗺 New York: #2,549 of 115,490 inventorsTop 3%
Overall (All Time): #75,336 of 4,157,543Top 2%
41
Patents All Time

Issued Patents All Time

Showing 26–41 of 41 patents

Patent #TitleCo-InventorsDate
10199264 Self aligned interconnect structures Xunyuan Zhang, Hoon Kim 2019-02-05
10181420 Devices with chamfer-less vias multi-patterning and methods for forming chamfer-less vias Jason E. Stephens, David Permana, Guillaume Bouche, Andy Wei, Mark A. Zaleski +6 more 2019-01-15
10153232 Crack stop with overlapping vias Robert J. Fox, Kevin Boyd, Nicholas A. Polomoff, Jeannine M. Trewhella 2018-12-11
10090258 Crack-stop structure for an IC product and methods of making such a crack-stop structure Kevin Boyd, Robert J. Fox, Jeannine M. Trewhella, Nicholas A. Polomoff 2018-10-02
9922929 Self aligned interconnect structures Xunyuan Zhang, Hoon Kim 2018-03-20
9864132 Silicon waveguide devices in integrated photonics Ajey Poovannummoottil Jacob, Steven M. Shank 2018-01-09
9576735 Vertical capacitors with spaced conductive lines Jason E. Stephens 2017-02-21
9431294 Methods of producing integrated circuits with an air gap Ming He, Errol Todd Ryan, Craig Child, Larry Zhao 2016-08-30
9147659 Bondpad arrangement with reinforcing structures between the bondpads 2015-09-29
9142513 Middle-of-the-line constructs using diffusion contact structures Mahbub Rashed, Yuansheng Ma, Irene Y. Lin, Jason E. Stephens, Yunfei Deng +5 more 2015-09-22
8987816 Contact power rail Jason E. Stephens, Marc Tarabbia, Nader Magdy Hindawy 2015-03-24
8946914 Contact power rail Jason E. Stephens, Marc Tarabbia, Nader Magdy Hindawy 2015-02-03
8349734 Integrated circuits having backside test structures and methods for the fabrication thereof 2013-01-08
8241927 Methods relating to capacitive monitoring of layer characteristics during back end-of the-line processing Jihong Choi, Yongsik Moon, Eden Zielinski 2012-08-14
7235867 Semiconductor device with electrically biased die edge seal Steven C. Avanzino 2007-06-26
7081638 System and method to improve uniformity of ultraviolet energy application and method for making the same 2006-07-25