Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8723214 | Submount and manufacturing method thereof | Wen-Cheng Chien | 2014-05-13 |
| 8637970 | Chip package and fabrication method thereof | Chia-Ming Cheng, Long-Sheng Yeou | 2014-01-28 |
| 8633091 | Chip package and fabrication method thereof | Tsang-Yu Liu, Chia-Ming Cheng | 2014-01-21 |
| 8541877 | Electronic device package and method for fabricating the same | Ching-Yu Ni, Tien-Hao Huang, Chia-Ming Cheng, Wen-Cheng Chien, Nan-Chun Lin +3 more | 2013-09-24 |
| 8524241 | Fusion proteins comprising a fragment of Vibrio cholerae exotoxin A | Brian Seed, Jia Liu Wolfe | 2013-09-03 |
| 8519512 | Test line placement to improve die sawing quality | Hao-Yi Tsai, Shang-Yun Hou, Shin-Puu Jeng, Shih-Hsun Hsu, Wei-Ti Hsu +2 more | 2013-08-27 |
| 8436934 | Method for using flash to assist in focal length detection | Chan-Min Chou, Tsung-Pin Lu, Tzu-Huang Huang, Chih-Pin Yen | 2013-05-07 |
| 8431950 | Light emitting device package structure and fabricating method thereof | Ching-Yu Ni, Wen-Cheng Chien, Shang-Yi Wu, Cheng-Te Chou | 2013-04-30 |
| 8432032 | Chip package and fabrication method thereof | Chia-Sheng Lin, Chang-Sheng Hsu, Po-Han Lee | 2013-04-30 |
| 8410599 | Power MOSFET package | Baw-Ching Perng, Ying-Nan Wen, Shu-Ming Chang, Ching-Yu Ni, Yun-Jui Hsieh +2 more | 2013-04-02 |
| 8399963 | Chip package and fabrication method thereof | Tsang-Yu Liu, Chia-Ming Cheng | 2013-03-19 |
| 8384222 | Semiconductor device and manufacturing method thereof | Ching-Yu Ni, Jack Chen, Wen-Cheng Chien | 2013-02-26 |
| 8319347 | Electronic device package and fabrication method thereof | Wen-Cheng Chien, Po-Han Lee, Wei-Ming Chen | 2012-11-27 |
| 8294810 | Assisting focusing method for face block | Chih-Pin Yen, Li-Wen Kuo | 2012-10-23 |
| 8284296 | Continuous focusing method for digital camera | Chan-Min Chou, Chih-Pin Yen | 2012-10-09 |
| 8259217 | Fast focusing method for digital camera | Chan-Min Chou, Chih-Pin Yen | 2012-09-04 |
| 8233787 | Focus method and photographic device using the method | Chih-Pin Yen, Li-Wen Kuo | 2012-07-31 |
| 8227917 | Bond pad design for fine pitch wire bonding | Shih-Hsun Hsu, Hao-Yi Tsai, Benson Liu, Hsien-Wei Chen, Anbiarshy Wu +2 more | 2012-07-24 |
| 7968448 | Semiconductor device and manufacturing method thereof | Ching-Yu Ni, Jack Chen, Wen-Cheng Chien | 2011-06-28 |
| 7811866 | Single passivation layer scheme for forming a fuse | Hao-Yi Tsai, Shang-Yun Hou, Anbiarshy Wu, Shin-Puu Jeng | 2010-10-12 |
| 7602065 | Seal ring in semiconductor device | Shang-Yun Hou, Chun-Hung Chen, Pao-Kang Niu, Shin-Puu Jeng | 2009-10-13 |
| 7449785 | Solder bump on a semiconductor substrate | Shin-Puu Jeng, Hao-Yi Tsai, Shang-Yun Hou, Hsien-Wei Chen | 2008-11-11 |
| 7397106 | Laser fuse with efficient heat dissipation | Hao-Yi Tsai, Chao-Hsiang Yang, Shang-Yun Hou, Shin-Puu Jeng | 2008-07-08 |