Issued Patents All Time
Showing 76–91 of 91 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7524374 | Method and apparatus for generating a precursor for a semiconductor processing system | Ling Chen, Vincent Ku, Hua Chung, Christophe Marcadal, Jenny Lin +3 more | 2009-04-28 |
| 7429402 | Ruthenium as an underlayer for tungsten film deposition | Srinivas Gandikota, Madhu Moorthy, Amit Khandelwal, Avgerinos V. Gelatos, Mei Chang +1 more | 2008-09-30 |
| 7429361 | Method and apparatus for providing precursor gas to a processing chamber | Ling Chen, Vincent Ku | 2008-09-30 |
| 7270709 | Method and apparatus of generating PDMAT precursor | Ling Chen, Vincent Ku, Hua Chung, Christophe Marcadal, Jenny Lin +3 more | 2007-09-18 |
| 7264846 | Ruthenium layer formation for copper film deposition | Mei Chang, Nirmalya Maity | 2007-09-04 |
| 7265048 | Reduction of copper dewetting by transition metal deposition | Hua Chung, Christophe Marcadal, Jick Yu | 2007-09-04 |
| 7186385 | Apparatus for providing gas to a processing chamber | Ling Chen, Vincent Ku | 2007-03-06 |
| 6953742 | Tantalum barrier layer for copper metallization | Ling Chen, Wei Cao, Christophe Marcadal | 2005-10-11 |
| 6905541 | Method and apparatus of generating PDMAT precursor | Ling Chen, Vincent Ku, Hua Chung, Christophe Marcadal, Jenny Lin +3 more | 2005-06-14 |
| 6872429 | Deposition of tungsten nitride using plasma pretreatment in a chemical vapor deposition chamber | Ling Chen, Alfred Mak | 2005-03-29 |
| 6772072 | Method and apparatus for monitoring solid precursor delivery | Vincent Ku, Hua Chung, Ling Chen | 2004-08-03 |
| 6660622 | Process for removing an underlying layer and depositing a barrier layer in one reactor | Ling Chen, Wei Cao, Christophe Marcadal | 2003-12-09 |
| 6607976 | Copper interconnect barrier layer structure and formation method | Ling Chen, Christophe Marcadal, Wei Cao, Roderick C. Mosely, Mei Chang | 2003-08-19 |
| 6498091 | Method of using a barrier sputter reactor to remove an underlying barrier layer | Ling Chen, Wei Cao, Christophe Marcadal | 2002-12-24 |
| 6319728 | Method for treating a deposited film for resistivity reduction | Mohan K. Bhan, Ling Chen, Bo Zheng, Justin Jones, Timothy E. Levine +2 more | 2001-11-20 |
| 6110530 | CVD method of depositing copper films by using improved organocopper precursor blend | Ling Chen, Bo Zheng, Samuel Wilson, Christophe Marcadal | 2000-08-29 |