Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5043299 | Process for selective deposition of tungsten on semiconductor wafer | Mei Chang | 1991-08-27 |
| 5028565 | Process for CVD deposition of tungsten layer on semiconductor wafer | Mei Chang, Cissy Leung, David Cheng | 1991-07-02 |
| 5000113 | Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process | John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy, Kenneth S. Collins +3 more | 1991-03-19 |
| 4962063 | Multistep planarized chemical vapor deposition process with the use of low melting inorganic material for flowing while depositing | Dan Maydan | 1990-10-09 |
| 4960488 | Reactor chamber self-cleaning process | Kam S. Law, Cissy Leung, Ching Chiang Tang, Kenneth S. Collins, Mei Chang +1 more | 1990-10-02 |
| 4951601 | Multi-chamber integrated process system | Dan Maydan, Sasson Somekh, David Cheng, Masato Toshima, Isaac Harari +1 more | 1990-08-28 |
| 4892753 | Process for PECVD of silicon oxide using TEOS decomposition | John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy, Kenneth S. Collins +3 more | 1990-01-09 |
| 4872947 | CVD of silicon oxide using TEOS decomposition and in-situ planarization process | John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy, Kenneth S. Collins +3 more | 1989-10-10 |
| 4854263 | Inlet manifold and methods for increasing gas dissociation and for PECVD of dielectric films | Mei Chang, John M. White, Dan Maydan | 1989-08-08 |
| 4842683 | Magnetic field-enhanced plasma etch reactor | David Cheng, Dan Maydan, Sasson Somekh, Kenneth R. Stalder, Dana L. Andrews +4 more | 1989-06-27 |
| 4668365 | Apparatus and method for magnetron-enhanced plasma-assisted chemical vapor deposition | Robert F. Foster, Sasson Somekh, Dan Maydan | 1987-05-26 |
| 4613400 | In-situ photoresist capping process for plasma etching | Simon W. Tam, Ronald P. Reade, Jerry Wong | 1986-09-23 |
| 4412885 | Materials and methods for plasma etching of aluminum and aluminum alloys | Frank D. Egitto, Dan Maydan | 1983-11-01 |
| 4383885 | Reactive sputter etching of polysilicon utilizing a chlorine etch gas | Dan Maydan | 1983-05-17 |
| 4376672 | Materials and methods for plasma etching of oxides and nitrides of silicon | Frank D. Egitto, Dan Maydan | 1983-03-15 |
| 4333793 | High-selectivity plasma-assisted etching of resist-masked layer | Nadia Lifshitz, Joseph M. Moran | 1982-06-08 |
| 4310380 | Plasma etching of silicon | Daniel Flamm, Dan Maydan | 1982-01-12 |
| 4256534 | Device fabrication by plasma etching | Hyman J. Levinstein | 1981-03-17 |