Issued Patents All Time
Showing 26–50 of 103 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600567 | Semiconductor device package and method for manufacturing the same | Kuang-Hsiung Chen | 2023-03-07 |
| 11600901 | Semiconductor device package and method of manufacturing the same | Cheng-Lin Ho, Chun-Chen Chen, Yuanhao Yu | 2023-03-07 |
| 11515270 | Semiconductor device package and method of manufacturing the same | Yu-Lin Shih | 2022-11-29 |
| 11469186 | Semiconductor device package and method for manufacturing the same | Hsing Kuo Tien | 2022-10-11 |
| 11432406 | Package substrate | Wu Chou Hsu, Hsing Kuo Tien, Min-Yao CHEN | 2022-08-30 |
| 11398421 | Semiconductor substrate and method for manufacturing the same | Chun-Che Lee, Ming-Chiang Lee, Yuan-Chang Su, Tien-Szu Chen, You-Lung Yen | 2022-07-26 |
| 11335650 | Package substrate, electronic device package and method for manufacturing the same | Wu Chou Hsu, Min-Yao CHEN, Hsing Kuo Tien | 2022-05-17 |
| 11300274 | Anti-loosing structure and backlight module | Hun-Yi Chou | 2022-04-12 |
| 11276660 | Semiconductor device package having a core substrate and an embedded component in the core substrate | — | 2022-03-15 |
| 11239184 | Package substrate, electronic device package and method for manufacturing the same | Wu Chou Hsu, Min-Yao CHEN, Hsing Kuo Tien | 2022-02-01 |
| 11233022 | Electrical connection placement of semiconductor device package and method of manufacturing the same | Cheng-Lin Ho | 2022-01-25 |
| 11232993 | Semiconductor device package and method of manufacturing the same | Yu-Lin Shih | 2022-01-25 |
| 11205628 | Semiconductor device package and method of manufacturing the same | Yu-Lin Shih | 2021-12-21 |
| 11201386 | Semiconductor device package and method for manufacturing the same | Cheng-Lin Ho, Chun-Chen Chen, Yuanhao Yu | 2021-12-14 |
| 11101186 | Substrate structure having pad portions | Cheng-Lin Ho | 2021-08-24 |
| 11088061 | Substrate, semiconductor device package and method of manufacturing the same | Cheng-Lin Ho | 2021-08-10 |
| 11062996 | Embedded component package structure and manufacturing method thereof | Hsing Kuo Tien | 2021-07-13 |
| 11056435 | Semiconductor package with chamfered pads | Cheng-Lin Ho, Chung-Chieh Chang, Ya Fang Chan | 2021-07-06 |
| 11031274 | Semiconductor device packages and method for manufacturing the same | Yu-Lin Shih | 2021-06-08 |
| 11024555 | Semiconductor substrate, semiconductor package, and method for forming the same | Cheng-Lin Ho | 2021-06-01 |
| 11018120 | Semiconductor device package with stress buffering layer and method for manufacturing the same | Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su +1 more | 2021-05-25 |
| 11004779 | Semiconductor device package and a method of manufacturing the same | Po-Shu Peng, Cheng-Lin Ho | 2021-05-11 |
| 10886208 | Semiconductor device package, electronic assembly and method for manufacturing the same | Cheng-Lin Ho, Chun-Chen Chen, Chen Chen | 2021-01-05 |
| 10748843 | Semiconductor substrate including embedded component and method of manufacturing the same | Li-Chuan Tsai, Po-Shu Peng, Cheng-Lin Ho | 2020-08-18 |
| 10734704 | Antenna package and method of manufacturing the same | Cheng-Lin Ho | 2020-08-04 |