CL

Chih-Cheng Lee

AE Advanced Semiconductor Engineering: 76 patents #2 of 1,073Top 1%
CH Chimei: 9 patents #6 of 103Top 6%
FC Futaijing Precision Electronics (Yantai) Co.: 9 patents #1 of 33Top 4%
Foxconn: 8 patents #709 of 5,504Top 15%
ST Sunrex Technology: 4 patents #11 of 48Top 25%
EG E. Gluck: 2 patents #9 of 19Top 50%
FL Fih (Hong Kong) Limited: 1 patents #329 of 652Top 55%
WI Wistron: 1 patents #959 of 2,107Top 50%
📍 New Taipei, TW: #33 of 10,472 inventorsTop 1%
Overall (All Time): #13,610 of 4,157,543Top 1%
103
Patents All Time

Issued Patents All Time

Showing 76–100 of 103 patents

Patent #TitleCo-InventorsDate
9966333 Semiconductor substrate, semiconductor module and method for manufacturing the same Li-Chuan Tsai 2018-05-08
9917071 Semiconductor packages Ying-Ta Chiu, Yong-Da Chiu, Dao-Long Chen, Chih-Pin Hung 2018-03-13
9887167 Embedded component package structure and method of manufacturing the same Hsing Kuo Tien, Li-Chuan Tsai 2018-02-06
9812387 Semiconductor substrate, semiconductor module and method for manufacturing the same Li-Chuan Tsai 2017-11-07
9754906 Double plated conductive pillar package substrate Li-Chuan Tsai 2017-09-05
9721899 Embedded component package structure and method of manufacturing the same Hsing Kuo Tien 2017-08-01
9721799 Semiconductor package with reduced via hole width and reduced pad patch and manufacturing method thereof Yu-Lin Shih 2017-08-01
9659853 Double side via last method for double embedded patterned substrate You-Lung Yen, Yuan-Chang Su 2017-05-23
9583427 Semiconductor substrate, semiconductor package structure and method of making the same Yuan-Chang Su, Cheng-Lin Ho, Chung-Ming Wu, You-Lung Yen 2017-02-28
9549468 Semiconductor substrate, semiconductor module and method for manufacturing the same Li-Chuan Tsai 2017-01-17
9481746 Modified high-cis isoprene polymer, method for producing the same, and tire containing aforementioned polymer Hung-Jui Kuo 2016-11-01
9475917 Rubber composition and manufacturing method for the same Kuei-Lun Cheng, Kuan-Lin Hsieh 2016-10-25
9426891 Circuit board with embedded passive component and manufacturing method thereof Li-Chuan Tsai 2016-08-23
9420695 Semiconductor package structure and semiconductor process Yuan-Chang Su, Cheng-Lin Ho 2016-08-16
9373601 Semiconductor substrate, semiconductor package structure and method of making the same Yuan-Chang Su, Cheng-Lin Ho, Chung-Ming Wu, You-Lung Yen 2016-06-21
9359462 Modified high cis butadiene-isoprene copolymer, method for producing the same and tire having aforementioned polymer Hung-Jui Kuo 2016-06-07
9056526 Modified copolymer of conjugated diene and vinyl aromatic hydrocarbon and polymerization method thereof Kuan-Lin Hsieh, Kuei-Lun Cheng 2015-06-16
8907023 Polysiloxane compound, modified conjugated diene-vinyl aromatic copolymer and preparing method thereof Kuan-Lin Hsieh, Kuei-Lun Cheng 2014-12-09
8895665 Modified conjugated diene polymer and synthesis method thereof Kuei-Lun Cheng, Chen-Pao Huang, Kuan-Lin Hsieh 2014-11-25
8896205 Quartz light John Lin 2014-11-25
8722810 Modified high CIS conjugated diene copolymer and preparing method of the same Kuei-Lun Cheng, Kuan-Lin Hsieh 2014-05-13
8674030 Modified high cis conjugated diene copolymer and manufacturing method of the same Kuei-Lun Cheng 2014-03-18
8461461 Embedded substrate having circuit layer element with oblique side surface and method for making the same 2013-06-11
8377506 Method of manufacturing a substrate structure 2013-02-19
8322032 Substrate structure and method for manufacturing the same 2012-12-04