Issued Patents All Time
Showing 51–75 of 103 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665523 | Semiconductor substrate, semiconductor package, and method for forming the same | Cheng-Lin Ho | 2020-05-26 |
| 10636730 | Semiconductor package and semiconductor manufacturing process | Cheng-Lin Ho, Li-Chuan Tsai | 2020-04-28 |
| 10631406 | Substrate structure and method for manufacturing the same | — | 2020-04-21 |
| 10615109 | Substrate, semiconductor device package and method of manufacturing the same | Cheng-Lin Ho | 2020-04-07 |
| 10515884 | Substrate having a conductive structure within photo-sensitive resin | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, Yu-Ying Lee, Li-Chuan Tsai | 2019-12-24 |
| 10497659 | Double plated conductive pillar package substrate | Li-Chuan Tsai | 2019-12-03 |
| 10446515 | Semiconductor substrate and semiconductor packaging device, and method for forming the same | Li-Chuan Tsai | 2019-10-15 |
| 10424547 | Semiconductor device package and a method of manufacturing the same | Yuan-Chang Su | 2019-09-24 |
| 10381296 | Semiconductor device package and a method of manufacturing the same | Li-Chuan Tsai | 2019-08-13 |
| 10354969 | Substrate structure, semiconductor package including the same, and method for manufacturing the same | Yu-Lin Shih | 2019-07-16 |
| 10340212 | Semiconductor package structure having a heat dissipation structure | Yu-Lin Shih | 2019-07-02 |
| 10334728 | Reduced-dimension via-land structure and method of making the same | Cheng-Lin Ho, Po-Shu Peng | 2019-06-25 |
| 10332757 | Semiconductor device package having a multi-portion connection element | Yu-Lin Shih | 2019-06-25 |
| 10325842 | Substrate for packaging a semiconductor device package and a method of manufacturing the same | Yuan-Chang Su | 2019-06-18 |
| 10276507 | Embedded component package structure and method of manufacturing the same | Hsing Kuo Tien | 2019-04-30 |
| 10181438 | Semiconductor substrate mitigating bridging | Chun-Che Lee, Ming-Chiang Lee, Yuan-Chang Su, Tien-Szu Chen, You-Lung Yen | 2019-01-15 |
| 10139913 | Rotational input device | Shun-Pin Lin | 2018-11-27 |
| 10128198 | Double side via last method for double embedded patterned substrate | You-Lung Yen, Yuan-Chang Su | 2018-11-13 |
| 10096542 | Substrate, semiconductor package structure and manufacturing process | Yuan-Chang Su | 2018-10-09 |
| 10083902 | Semiconductor package structure and semiconductor process | Yuan-Chang Su, Cheng-Lin Ho | 2018-09-25 |
| 10079156 | Semiconductor package including dielectric layers defining via holes extending to component pads | Yuan-Chang Su, Yu-Lin Shih, You-Lung Yen | 2018-09-18 |
| 10074602 | Substrate, semiconductor package structure and manufacturing process | — | 2018-09-11 |
| 10017635 | Thermoplastic resin composition and product formed therefrom | — | 2018-07-10 |
| 9997442 | Semiconductor device and method of manufacturing the same | Chai-Chi Lin, Hsing Kuo Tien, Chih-Yung Yang | 2018-06-12 |
| 9984898 | Substrate, semiconductor package including the same, and method for manufacturing the same | Li-Chuan Tsai, Cheng-Lin Ho | 2018-05-29 |