Issued Patents 2025
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266639 | Method of fabricating semiconductor package | Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2025-04-01 |
| 12261126 | Semiconductor package | Tsung-Hsien Chiang, Hsien-Ming Tu, Tin-Hao Kuo | 2025-03-25 |
| 12260669 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Chen-Hua Yu, Yu-Chih Huang | 2025-03-25 |
| 12261092 | Semiconductor package and manufacturing method thereof | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Ban-Li Wu, Hsiu-Jen Lin +1 more | 2025-03-25 |
| 12255196 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Lipu Kris Chuang, Tin-Hao Kuo | 2025-03-18 |
| 12255174 | Bonding passive devices on active dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo +1 more | 2025-03-18 |
| 12255184 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo | 2025-03-18 |
| 12243681 | Programmable inductor and methods of manufacture | Chen-Hua Yu, Mirng-Ji Lii, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu | 2025-03-04 |
| 12222545 | Package and method of forming same | Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Chung-Shi Liu +1 more | 2025-02-11 |
| 12210200 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more | 2025-01-28 |
| 12205860 | Sensor packages | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2025-01-21 |
| 12205923 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Chung-Shi Liu, Yu-Chia Lai, Po-Yuan Teng | 2025-01-21 |
| 12199051 | Integrated circuit structure and method | Chen-Hua Yu, Kuo Lung Pan, Tin-Hao Kuo | 2025-01-14 |