Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136623 | Multi-device semiconductor chip with electrical access to devices at either side | Edward Fuergut, Peter Friedrichs, Hans-Joachim Schulze | 2024-11-05 |
| 12068226 | Semiconductor assembly with multi-device cooling | — | 2024-08-20 |
| 12068213 | Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof | Thai Kee Gan, Sanjay Kumar Murugan | 2024-08-20 |
| 11984392 | Semiconductor package having a chip carrier with a pad offset feature | Chee Yang Ng, Stefan Woetzel, Edward Fuergut, Thai Kee Gan, Chee Hong Lee +1 more | 2024-05-14 |
| 11978693 | Semiconductor device package comprising side walls connected with contact pads of a semiconductor die | Petteri Palm, Ulrich Froehler, Andreas Riegler | 2024-05-07 |
| 11942383 | Linear spacer for spacing a carrier of a package | Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Daniel Pedone, Bernd Schmoelzer | 2024-03-26 |
| 11929298 | Molded semiconductor package with dual integrated heat spreaders | Jo Ean Joanna Chye, Edward Fuergut | 2024-03-12 |
| 11923276 | Semiconductor device including a bidirectional switch | Klaus Schiess, Michael Treu | 2024-03-05 |
| 11915999 | Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element | Tomasz Naeve, Thorsten Scharf, Markus Dinkel, Martin Gruber, Elvir Kahrimanovic | 2024-02-27 |