Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125772 | Method of forming a semiconductor package with connection lug | Edward Fuergut, Martin Gruber, Herbert Hopfgartner | 2024-10-22 |
| 12094793 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Ke Yan Tean, Lee Shuang Wang | 2024-09-17 |
| 12080669 | Semiconductor device module having vertical metallic contacts and a method for fabricating the same | Edward Fuergut, Martin Gruber, Petteri Palm, Wolfgang Scholz, Mark A. Thomas | 2024-09-03 |
| 12002739 | Semiconductor device including an embedded semiconductor die | Edward Fuergut, Achim Althaus, Martin Gruber, Marco Mueller, Wolfgang Scholz +1 more | 2024-06-04 |
| 11942383 | Linear spacer for spacing a carrier of a package | Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Ralf Otremba, Daniel Pedone | 2024-03-26 |
| 11876028 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Chii Shang Hong, Teck Sim Lee, Ke Yan Tean, Lee Shuang Wang | 2024-01-16 |