Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094793 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Chii Shang Hong, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang | 2024-09-17 |
| 11942383 | Linear spacer for spacing a carrier of a package | Edward Fuergut, Chii Shang Hong, Ralf Otremba, Daniel Pedone, Bernd Schmoelzer | 2024-03-26 |
| 11876028 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Chii Shang Hong, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang | 2024-01-16 |