Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094793 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Teck Sim Lee, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang | 2024-09-17 |
| 12080625 | Semiconductor package with releasable isolation layer protection | Li Fong Chong, Yee Beng Daryl Yeow, Azlina Kassim, Hui Kin Lit | 2024-09-03 |
| 11942383 | Linear spacer for spacing a carrier of a package | Edward Fuergut, Teck Sim Lee, Ralf Otremba, Daniel Pedone, Bernd Schmoelzer | 2024-03-26 |
| 11908771 | Power semiconductor device with dual heat dissipation structures | Jayaganasan Narayanasamy, Angel Enverga, Chee Ming Lam, Sanjay Kumar Murugan, Subaramaniym Senivasan | 2024-02-20 |
| 11876028 | Package with electrically insulated carrier and at least one step on encapsulant | Edward Fuergut, Teck Sim Lee, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang | 2024-01-16 |