Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080625 | Semiconductor package with releasable isolation layer protection | Li Fong Chong, Yee Beng Daryl Yeow, Chii Shang Hong, Hui Kin Lit | 2024-09-03 |
| 12057376 | Three level interconnect clip | Thai Kee Gan, Mark Pavier, Ke Yan Tean, Mohd Hasrul Zulkifli | 2024-08-06 |