Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068213 | Chip package and semiconductor arrangement having thermally conductive material in contact with a semiconductor chip and methods of forming thereof | Sanjay Kumar Murugan, Ralf Otremba | 2024-08-20 |
| 12057376 | Three level interconnect clip | Azlina Kassim, Mark Pavier, Ke Yan Tean, Mohd Hasrul Zulkifli | 2024-08-06 |
| 11984392 | Semiconductor package having a chip carrier with a pad offset feature | Chee Yang Ng, Stefan Woetzel, Edward Fuergut, Chee Hong Lee, Jayaganasan Narayanasamy +1 more | 2024-05-14 |