Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984392 | Semiconductor package having a chip carrier with a pad offset feature | Chee Yang Ng, Edward Fuergut, Thai Kee Gan, Chee Hong Lee, Jayaganasan Narayanasamy +1 more | 2024-05-14 |