Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136623 | Multi-device semiconductor chip with electrical access to devices at either side | Peter Friedrichs, Ralf Otremba, Hans-Joachim Schulze | 2024-11-05 |
| 12125772 | Method of forming a semiconductor package with connection lug | Martin Gruber, Herbert Hopfgartner, Bernd Schmoelzer | 2024-10-22 |
| 12094793 | Package with electrically insulated carrier and at least one step on encapsulant | Chii Shang Hong, Teck Sim Lee, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang | 2024-09-17 |
| 12080669 | Semiconductor device module having vertical metallic contacts and a method for fabricating the same | Martin Gruber, Petteri Palm, Bernd Schmoelzer, Wolfgang Scholz, Mark A. Thomas | 2024-09-03 |
| 12002739 | Semiconductor device including an embedded semiconductor die | Achim Althaus, Martin Gruber, Marco Mueller, Bernd Schmoelzer, Wolfgang Scholz +1 more | 2024-06-04 |
| 11984392 | Semiconductor package having a chip carrier with a pad offset feature | Chee Yang Ng, Stefan Woetzel, Thai Kee Gan, Chee Hong Lee, Jayaganasan Narayanasamy +1 more | 2024-05-14 |
| 11955407 | Electronic module including a semiconductor package connected to a fluid heatsink | Davide Chiola, Martin Gruber, Wolfram Hable | 2024-04-09 |
| 11942383 | Linear spacer for spacing a carrier of a package | Chii Shang Hong, Teck Sim Lee, Ralf Otremba, Daniel Pedone, Bernd Schmoelzer | 2024-03-26 |
| 11929298 | Molded semiconductor package with dual integrated heat spreaders | Jo Ean Joanna Chye, Ralf Otremba | 2024-03-12 |
| 11876028 | Package with electrically insulated carrier and at least one step on encapsulant | Chii Shang Hong, Teck Sim Lee, Bernd Schmoelzer, Ke Yan Tean, Lee Shuang Wang | 2024-01-16 |