Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955407 | Electronic module including a semiconductor package connected to a fluid heatsink | Edward Fuergut, Davide Chiola, Martin Gruber | 2024-04-09 |
| 11862533 | Fluid-cooled package having shielding layer | Andreas Grassmann, Juergen Hoegerl, Ivan Nikitin, Achim Strass | 2024-01-02 |