Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002724 | Power module with metal substrate | Wu Hu Li, Raphael Hellwig, Olaf Hohlfeld, Martin Mayer | 2024-06-04 |
| 11901273 | Power module with press-fit contacts | Peter Luniewski | 2024-02-13 |
| 11862533 | Fluid-cooled package having shielding layer | Andreas Grassmann, Wolfram Hable, Juergen Hoegerl, Achim Strass | 2024-01-02 |