Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165959 | Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method | Frank Singer, Marcus Boehm, Martin Gruber, Uwe Schindler | 2024-12-10 |
| 11973012 | Power module with semiconductor packages mounted on metal frame | — | 2024-04-30 |
| 11908760 | Package with encapsulated electronic component between laminate and thermally conductive carrier | — | 2024-02-20 |
| 11862533 | Fluid-cooled package having shielding layer | Wolfram Hable, Juergen Hoegerl, Ivan Nikitin, Achim Strass | 2024-01-02 |