US

Uwe Schindler

Infineon Technologies Ag: 1 patents #273 of 819Top 35%
📍 Reichenbach, DE: #4 of 8 inventorsTop 50%
Overall (2024): #231,854 of 561,600Top 45%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12165959 Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method Frank Singer, Marcus Boehm, Andreas Grassmann, Martin Gruber 2024-12-10