MB

Marcus Boehm

Infineon Technologies Ag: 1 patents #273 of 819Top 35%
📍 Thalmässing, NJ: #1 of 1 inventorsTop 100%
Overall (2024): #364,500 of 561,600Top 65%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12165959 Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method Frank Singer, Andreas Grassmann, Martin Gruber, Uwe Schindler 2024-12-10