Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165959 | Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method | Frank Singer, Marcus Boehm, Andreas Grassmann, Uwe Schindler | 2024-12-10 |
| 12154886 | Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereof | Thorsten Meyer, Thorsten Scharf | 2024-11-26 |
| 12125772 | Method of forming a semiconductor package with connection lug | Edward Fuergut, Herbert Hopfgartner, Bernd Schmoelzer | 2024-10-22 |
| 12080669 | Semiconductor device module having vertical metallic contacts and a method for fabricating the same | Edward Fuergut, Petteri Palm, Bernd Schmoelzer, Wolfgang Scholz, Mark A. Thomas | 2024-09-03 |
| 12002739 | Semiconductor device including an embedded semiconductor die | Edward Fuergut, Achim Althaus, Marco Mueller, Bernd Schmoelzer, Wolfgang Scholz +1 more | 2024-06-04 |
| 11955415 | Semiconductor device package comprising a pin in the form of a drilling screw | Thorsten Scharf, Thomas Bemmerl, Thorsten Meyer, Frank Singer | 2024-04-09 |
| 11955407 | Electronic module including a semiconductor package connected to a fluid heatsink | Edward Fuergut, Davide Chiola, Wolfram Hable | 2024-04-09 |
| 11915999 | Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element | Tomasz Naeve, Ralf Otremba, Thorsten Scharf, Markus Dinkel, Elvir Kahrimanovic | 2024-02-27 |
| 11862582 | Package with elevated lead and structure extending vertically from encapsulant bottom | Thorsten Meyer, Thomas Bemmerl, Martin Richard Niessner | 2024-01-02 |