Issued Patents 2024
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12184970 | Camera device, motor vehicle, method and computer program product | Harald Barth | 2024-12-31 |
| 12176222 | Semiconductor package with metal posts from structured leadframe | Chau Fatt Chiang, Chan Lam Cha, Wern Ken Daryl Wee, Chee Hong Lee, Swee Kah Lee +2 more | 2024-12-24 |
| 12158448 | Radiation source device | Derek Debie, Klaus Elian, Ludwig Heitzer, David Tumpold, Jens Pohl +3 more | 2024-12-03 |
| 12154886 | Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereof | Martin Gruber, Thorsten Scharf | 2024-11-26 |
| 12136670 | Semiconductor device having contact trenches extending from opposite sides of a semiconductor body | Markus Zundel, Andreas Meiser, Hans-Peter Lang, Peter Irsigler | 2024-11-05 |
| 12094842 | Semiconductor device having an antenna arranged over an active main surface of a semiconductor die | Walter Hartner, Maciej Wojnowski | 2024-09-17 |
| 11984246 | Vertical inductor for WLCSP | Andreas Wolter, Gerhard Knoblinger | 2024-05-14 |
| 11955415 | Semiconductor device package comprising a pin in the form of a drilling screw | Thorsten Scharf, Thomas Bemmerl, Martin Gruber, Frank Singer | 2024-04-09 |
| 11862582 | Package with elevated lead and structure extending vertically from encapsulant bottom | Thomas Bemmerl, Martin Gruber, Martin Richard Niessner | 2024-01-02 |