Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862582 | Package with elevated lead and structure extending vertically from encapsulant bottom | Thorsten Meyer, Thomas Bemmerl, Martin Gruber | 2024-01-02 |
MN
Martin Richard Niessner
Overall (2024): #354,728 of 561,600Top 65%
1
Patents 2024