Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955415 | Semiconductor device package comprising a pin in the form of a drilling screw | Thorsten Scharf, Martin Gruber, Thorsten Meyer, Frank Singer | 2024-04-09 |
| 11869830 | Semiconductor package and clip with a die attach | Michael Stadler | 2024-01-09 |
| 11869865 | Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof | Chooi Mei Chong, Edward Myers, Michael Stadler | 2024-01-09 |
| 11862582 | Package with elevated lead and structure extending vertically from encapsulant bottom | Thorsten Meyer, Martin Gruber, Martin Richard Niessner | 2024-01-02 |