Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154886 | Semiconductor packages including electrical redistribution layers of different thicknesses and methods for manufacturing thereof | Thorsten Meyer, Martin Gruber | 2024-11-26 |
| 12027481 | Device including semiconductor chips and method for producing such device | Petteri Palm | 2024-07-02 |
| 12027490 | Semiconductor device and method for fabricating the same | Richard Knipper, Alexander Heinrich, Stefan Schwab | 2024-07-02 |
| 11955415 | Semiconductor device package comprising a pin in the form of a drilling screw | Thomas Bemmerl, Martin Gruber, Thorsten Meyer, Frank Singer | 2024-04-09 |
| 11915999 | Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element | Tomasz Naeve, Ralf Otremba, Markus Dinkel, Martin Gruber, Elvir Kahrimanovic | 2024-02-27 |
| 11862600 | Method of forming a chip package and chip package | Alexander Heinrich, Steffen Jordan | 2024-01-02 |