Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862600 | Method of forming a chip package and chip package | Thorsten Scharf, Alexander Heinrich | 2024-01-02 |
SJ
Steffen Jordan
Overall (2024): #259,791 of 561,600Top 50%
1
Patents 2024