Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166005 | Semiconductor device having a soldered joint with one or more intermetallic phases | Konrad Roesl, Kirill Trunov, Arthur Unrau | 2024-12-10 |
| 12064606 | Data collection apparatus for attachment to an injection device | Christian Rehbein, Sven Hagebusch, Chris Knorr, Maurice Toporek, Matthias Felber | 2024-08-20 |
| 12069802 | Pre-plating of solder layer on solderable elements for diffusion soldering | Alexander Roth | 2024-08-20 |
| 12027490 | Semiconductor device and method for fabricating the same | Richard Knipper, Thorsten Scharf, Stefan Schwab | 2024-07-02 |
| 12023762 | Layer structure with an intermetallic phase layer and a chip package that includes the layer structure | Alexander Roth, Catharina Wille | 2024-07-02 |
| 11944796 | Data collection apparatus for attachment to an injection device | Maurice Toporek, Matthias Felber, Christoph Matthias Gugl, Marcus-Meinolf Dittrich, Christian Nessel +5 more | 2024-04-02 |
| 11865313 | Data collection apparatus for attachment to an injection device | Christian Rehbein, Sven Hagebusch, Chris Knorr, Maurice Toporek, Matthias Felber | 2024-01-09 |
| 11862600 | Method of forming a chip package and chip package | Thorsten Scharf, Steffen Jordan | 2024-01-02 |