Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12023762 | Layer structure with an intermetallic phase layer and a chip package that includes the layer structure | Alexander Heinrich, Alexander Roth | 2024-07-02 |
CW
Catharina Wille
Overall (2024): #517,407 of 561,600Top 95%
1
Patents 2024