Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166005 | Semiconductor device having a soldered joint with one or more intermetallic phases | Alexander Heinrich, Konrad Roesl, Kirill Trunov | 2024-12-10 |
| 12148718 | Housing, semiconductor module and methods for producing the same | Johannes Uhlig, Jens Krugmann, Ulrich Nolten, Regina Nottelmann | 2024-11-19 |
| 11942335 | Manufacturing a module with solder body having elevated edge | Achim Muecke | 2024-03-26 |
| 11935811 | Baseplate for a semiconductor module and method for producing a baseplate | Elmar Kuehle | 2024-03-19 |