Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12152133 | Mold compounds and packages for encapsulating electronic components | Andreas Waterloo | 2024-11-26 |
| 12136578 | Interlayer of sub-structure having elevations and further sub-structure with filler particles in recesses between the elevations | Edmund Riedl | 2024-11-05 |
| 12027490 | Semiconductor device and method for fabricating the same | Richard Knipper, Alexander Heinrich, Thorsten Scharf | 2024-07-02 |