Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136578 | Interlayer of sub-structure having elevations and further sub-structure with filler particles in recesses between the elevations | Stefan Schwab | 2024-11-05 |
ER
Edmund Riedl
Overall (2024): #478,796 of 561,600Top 90%
1
Patents 2024