Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12014964 | Semiconductor package having an electrically insulating core with exposed glass fibres | Eung San Cho, Petteri Palm | 2024-06-18 |
| 11979096 | Multiphase inverter apparatus having half-bridge circuits and a phase output lead for each half-bridge circuit | Elvir Kahrimanovic, Petteri Palm | 2024-05-07 |
| 11973063 | Semiconductor package with low parasitic connection to passive device | Urban Medic, Eung San Cho | 2024-04-30 |
| 11915999 | Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element | Ralf Otremba, Thorsten Scharf, Markus Dinkel, Martin Gruber, Elvir Kahrimanovic | 2024-02-27 |