Issued Patents 2024
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176283 | Die package and method of forming a die package | — | 2024-12-24 |
| 12159829 | Semiconductor package with non-uniformly distributed vias | Sergey Yuferev, Robert Fehler | 2024-12-03 |
| 12094807 | Stacked transistor chip package with source coupling | Sergey Yuferev, Paul Armand Asentista Calo, Theng Chao Long, Josef Maerz, Chee Yang Ng +1 more | 2024-09-17 |
| 12080669 | Semiconductor device module having vertical metallic contacts and a method for fabricating the same | Edward Fuergut, Martin Gruber, Bernd Schmoelzer, Wolfgang Scholz, Mark A. Thomas | 2024-09-03 |
| 12033909 | Die package and method of manufacturing a die package | Angela Kessler | 2024-07-09 |
| 12027481 | Device including semiconductor chips and method for producing such device | Thorsten Scharf | 2024-07-02 |
| 12014964 | Semiconductor package having an electrically insulating core with exposed glass fibres | Eung San Cho, Tomasz Naeve | 2024-06-18 |
| 12009290 | Semiconductor module having a multi-branch switch node connector | Sergey Yuferev, Robert Fehler, Angela Kessler, Gerhard Noebauer | 2024-06-11 |
| 11996771 | Power semiconductor system having an inductor module attached to a power stage module | Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski, Xaver Schloegel +1 more | 2024-05-28 |
| 11979096 | Multiphase inverter apparatus having half-bridge circuits and a phase output lead for each half-bridge circuit | Tomasz Naeve, Elvir Kahrimanovic | 2024-05-07 |
| 11978693 | Semiconductor device package comprising side walls connected with contact pads of a semiconductor die | Ulrich Froehler, Ralf Otremba, Andreas Riegler | 2024-05-07 |
| 11903132 | Power electronic assembly having a laminate inlay and method of producing the power electronic assembly | Martin Benisek, Liu Chen, Frank Daeche, Josef Maerz | 2024-02-13 |